•  Controlling ESD in Automated Equipment by Proper Grounding

           D. Bellmore

This course will focus on the grounding and material requirements of ESD Controls in Automated Handling Equipment (AHE) for prevention of CDM and MM type damage to ESD sensitive devices. Design methods and material selections that provide effective ground paths through the assembly will be introduced. Test methods used to qualify the design will be discussed. Students will also become familiar with different types of plating and practices to provide effective designs.

•  Ultra-Sensitivity Trends and CDM

           T. Dangelmayer

The electronics industry faces a double challenge: increasing use of ultra sensitive devices and lack of experience with the Charge Device Model (CDM). This class will give you the background to understand the challenges and prepare to meet them. Case studies will illustrate how CDM failures can persist even with a robust HBM program in place. A series of photographs of common CDM issues in manufacturing will enable students to visualize how to implement CDM controls. A brief summary of the work by the Industry Council on ESD Target Levels will be included.

•  Charged Board Events: A Growing Industry Concern

           T. Welsher

A charged board stores much more energy than a device (IC) because its capacitance is many times larger. In fact, the charge (energy) transferred in the event is so large that it can cause EOS-like failures to the components on the board. In this seminar, this board-level ESD event will be compared with the component level CDM ESD event. The waveforms from both ESD events will be compared and it will be shown that for the same voltage, the current in the board-level ESD event will be much higher than that from the chip-level ESD event. A summary of literature and industry data will be given. It is suggested that failure analysts give stronger consideration to these types of board level events before assigning an EOS diagnosis to the failure. This will support more effective root cause analysis and prevention of these failures.

•  Grounding in an Electrostatic Protected Area

           D. Swenson

Grounding is perhaps the single most important technical aspect in establishing an electrostatic protected area. The ESD Association grounding standard ANSI/ESD S6.1 provides potential users with specifications, guidance and suggestions for implementing a grounding/bonding system suitable for nearly any imaginable application. This information is not found anywhere else in industry literature.
This web-based training session will include answers to the following questions:
•What grounding method is appropriate for a work area?
•What measurements are needed?
•Are there any new terms or definitions?
•What are the proper ways to ground personnel in the workplace?

•  Air Ionization: Theory and Practice

           A. Steinman

Solve Problems Caused By Static Charge With Air Ionization

The primary method of static charge control is direct connection to ground for conductors, static dissipative materials, and personnel. But a complete static control program must also deal with isolated conductors, insulating materials, and moving personnel that cannot be grounded. Air ionization can neutralize the charge on insulated and isolated objects. This seminar will cover the following topics:
•Importance of Ionization in a Static Control Program
•Ionization Fundamentals and Methods
•Ionizer Selection Criteria and Examples
•ANSI/ESD S20.20 Static Control Program Requirements for Ionization

•  Susceptibility Testing of Devices and Systems

           M. Hopkins

There is a disconnect in the EMC (ElectroMagnetic Compatibility) world between system manufacturers testing systems for upset and device manufacturers testing devices for failure. Some system level manufacturers are pushing device manufacturers to test semiconductor devices using system level compliance standards – specifically, IEC 61000-4-2 for ESD (Electrostatic Discharge). Product manufacturers would like to believe that if devices are qualified to IEC standard(s), finished products will likewise be qualified. Unfortunately, there is a fundamental difference between system level and device level testing; fortunately however, this difference can be bridged using new susceptibility scanning techniques on the board or device. Until now, EMC and ESD susceptibility testing at the device level has not been done. In this course, we will cover scanning methods (using a magnetic field noise source and probe) that allow identification of susceptible devices in a system, sensitive areas/pins of devices and associated circuitry.

•  Advanced ESD/EMI Auditing Techniques

           A. Wallash

In order to solve today’s ESD problems, ESD auditing must provide data on not only the static charge and voltage on tooling and devices, but also the transient voltage, current and electromagnetic field interference (EMI) up to at least 1 GHz. This practical course will teach how to use a variety of charge, current, voltage and E-field probes to understand the ESD/EMI threats during processing of ESD sensitive devices.

•  ESD Problem Solving

           J. Kinnear

Its Friday at 3:00 and your quality manager calls you, “We are having ESD failures”. Now what do you do? Go out and audit your line? This online course will outline the steps that you should take to examine your process before you audit your line or even leave your office. A systematic approach will be explained on the logical steps to take for ESD troubleshooting. Only after such an analysis should you go on the line for measurements or assessments.

•  The Good, The Challenges, and the Improvements in CDM ESD Testing

           L. G. Henry

CDM ESD Stress Testing of ICs has changed and improved since CDM standards were first published in 1995 (JEDEC) and 1999 (ESDA). The method on which these standards are based was introduced in 1989. The purpose of this Webinar is to present these improved changes and at the same time teach the basics of good CDM stress testing of ICs as required by the CDM standard. Minimum equipment requirements to produce an adequate CDM waveform will be discussed. The need for good and proper equipment/tester qualification, calibration and periodic verification will be presented. It will be shown how the CDM stress testing requirements combined with proper stress testing procedures will lead to good and reliable qualification of product. Finally, improvements associated with the most recent releases of 2 documents ( the ANSI/ESD CDM-5.3.1 standard and the JEDEC- CDM JESD-22C-101E- standard) will be presented and the commonality between the 2 documents will be emphasized.

•  Electrostatic Attraction

           C. Newberg

This training will cover the causes and effects of electrostatic attraction (ESA) and the solution to ESA problems in a variety of industries. Electrostatic attraction problems plague industries from photographic to medical and electronics. In the electronics industry alone, electrostatic attraction problems can be found in disk drive assembly, wafer fabrication and PC board assembly. The solutions to these problems can be found by applying a combination of the fundamentals of electrostatics and contamination control. An overview of clean rooms, ionization, materials and the control of static electricity will be presented. Real world problems and their solutions will be discussed using case histories.

I. Basics of electrostatics
II. Types of bonding
III. Physics of electrostatic attraction
IV. Industrial problems
V. Solving electrostatic attraction problems
VI. Case studies