Kay Adams, Tech Wear, Inc., Carlsbad, CA
WG 2
Thomas Albano, ITT Space Systems Division, Rochester, NY
WG 2, WG 10, STDCOM
Warren Anderson, AMD, Boxborough, MA
Technical Program Committee, Steering Committee, IEW Committee
Robert Ashton, ON Semiconductor, Phoenix, AZ
JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, Technical Program Committee, Education Committee, Marketing & Communications, ESDA Board of Directors
Marise Bafleur, LAAS/CNRS, Toulouse, France
Technical Program Committee, IEW Committee
Jon Barth, Barth Electronics, Inc., Boulder, NV
JWG CDM, WG 5.3.1, WG 5.5, WG 5.6, WG 14, Technical Program Committee
Brent Beamer, 3M, Sanford, NC
STDCOM, Nominations Committee, Marketing & Communications, WG 1, WG 3, WG 4, WG7, WG 9, WG11, WG17, WG 20, WG 97
Donn Bellmore, Advanced ESD Services +, Binghamton, NY
ESDA Board of Directors, President Emeritus, EXCOM, Marketing & Communications, STDCOM, Human Resources, Nominations Committee, Education, Technical Program Committee, WG 2, WG 3
Patrice Besse, Freescale Semiconductors, Toulouse, France
Technical Program Committee
Andrea Boroni, STMicroelectronics, Agrate Brianza, Italy
WG 5.2, JWG HBM
Gianluca Boselli, Texas Instruments, Inc., Dallas, TX
Symposium Business Unit Manager, Steering Committee, Technical Program Committee, ESDA Board of Directors, Education Committee, Marketing & Communications Committee
Aniket Breed, Intel Corp., Folsom, CA
WG 5.6
Victor Cao,QRP, Inc., Tucson, AZ
Technical Program Committee
Laurie Casselman, QRP, Inc., Tucson, AZ
WG 15
Lorenzo Cerati, STMicroelectronics, AgrateBrianza, Italy
Technical Program Committee, IEW Committee, WG 14, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6
Mike Chaine, Micron Technology, Inc., Boise, ID
STDCOM, JWG HBM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.5, Technical Program Committee
Cheryl Checketts, General Dynamics, Scottsdale, AZ
STDCOM, Nominations Committee, Steering Committee, WG 1, WG 13, WG 16, WG 53
Charles Chu, Altera Corporation, San Jose, CA
Technical Program Committee
Dan Clement, ON Semiconductor, American Fork, UT
JWG HBM, JWG CDM
Ann Concannon, Texas Instruments, Santa Clara, CA
Technical Program Committee
Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA
Education Committee, Technical Program Committee
Bill DeJean, TDI International, Inc., Tucson, AZ
WG 13
Marcel Dekker, MASER Engineering BV, Enschede, The Netherlands
JWG HBM, WG 5.1, JWG CDM, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6
Rejean Dion, Bystat International, Inc., St. Laurent, QC, Canada
WG 2, WG 7, WG 10
Kevin Duncan, Seagate Technology, Bloomington, MN
STDCOM, WG 3, WG 4, WG 9, WG 11, WG 97, Technical Program Committee
Jeff Dunnihoo, NPX Semiconductors, Bertram, TX
WG 14, Technical Program Committee, Human Resources Committee
Charvaka Duvvury, Texas Instruments, Dallas, TX
ESDA Board of Directors, Human Resources, Education, Nominations Committee, Technical Liaison Team, Awards Committee, IEW Committee
Kurt Edwards, Lubrizol Conductive Polymers, Chino Hills, CA
WG 1, WG2, WG11, WG 13, STDCOM
David Eppes, Advanced Micro Devices, Austin, TX
WG 5.6
Kai Esmark, Infineon Technologies, Munich, Germany
Technical Liaison Team
Melanie Etherton, Freescale Semiconductor, Austin, TX
Technical Program Committee, Steering Committee
Mark Fancourt, Lehigh Safety Shoe Co., Nelsonville, OH
WG 9
Marti Farris, Intel Corporation, Hillsboro, OR
JWG HBM, WG 5.2, JWG CDM, WG 5.4, Marketing & Communications- Communications Chair
Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA
STDCOM, WG 16
Eugene Felder, Desco Industries, Inc., Laguna Beach, CA
WG 1, WG 2, WG 3, WG 11, WG 13, WG 16, WG 53
Yasuhiro Fukido, OKI Electronics
Technical Program Committee
Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany
JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 17, TAS, Technical Program Committee, ESDA Board of Directors, Education Committee
Robert Gauthier, IBM, Essex Junction, VT
Vice President, WG 5.4, WG 5.6, Symposium General Chair, Steering Committee, IEW Committee, ESDA Board of Directors, EXCOM, Secretary, Education Committee, Marketing & Communications, Technical Program Committee
Steve Gerken, United States Air Force, Wright-Patterson AFB, OH
WG 20
Ron Gibson, Toronto, ON, Canada
WG 20
Horst Gieser, Fraunhofer IZM, Munich, Germany
IEW Committee, JWG HBM, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14
Chai Gill, Freescale Semiconductors, Tempe, AZ
Technical Program Committee
Harald Gossner, Infineon Technologies, Neubiberg, Germany
IEW Committee, Steering Committee
Dale Gross, Flexco, Gresham, OR
WG 7
Vaughn Gross, Green Mountain ESD Labs, Inc., St. Albans, VT
STDCOM, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6
Evan Grund, Grund Technical Solutions, LLC, San Jose, CA
STDCOM, TAS, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, Nominations Committee, Technical Program Committee
Bruno Guidotti, Forbo Flooring, Giubiasco, Switzerland
WG 7
Ginger Hansel, Dangelmayer Associates LLC, Austin, TX
ESDA Board of Directors, Education Business Unit Manager, Human Resources Committee, IEW Committee, Marketing & Communications Committee
Keiichi Hasegawa, Hanwa Electronic Ind. Co., Ltd., Wakayama City, Japan
WG 5.6
Leo G. Henry, ESD & TLP Consultants, Freemont, CA
ESDA Board of Directors, President, EXCOM, TAS, Education Committee, STDCOM, Technical Liaison Team, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, Education Council, Marketing & Communications, Nominations Committee, Human Resources, IEW Committee
Steffen Holland, NXP Semiconductors, Hamburg, Germany
Technical Program Committee
Mike Hopkins, Amber Precision Instruments, Hollis, NH
STDCOM, WG 5.4, WG 5.6, WG 14, Technical Program Committee
Tim Iben, IBM, San Jose, CA
Technical Program Committee
Adrien Ille, Infineon Technologies, Neubiberg, Germany
Technical Program Committee
Hiroyasu Ishizuka, Renasas Technology Corporation, Tokyo, Japan
Technical Program Committee, IEW Committtee
Satoshi Isofuku, Tokyo Electronics Trading Co., Ltd., Tokyo, Japan
Technical Program Committee
Agha Jahanzeb, Texas Instruments, Dallas, TX
Technical Program Committee
Ryan Hsin-Chin Jiang, AmazingIC, Hsinchu, Taiwan
IEW Committee
Guy Kasai, Gibo Kodama Chairs, Huntington Beach, CA
WG 12
Bart Keppens, SOFICS, Gistel, Belgium
Technical Program Committee, Marketing Committee-Social Media, IEW Committee
Ming Dou Ker, National Chiao-Tung University, Hsinchu-City, Taiwan
IEW Committee
Michael Khazhinsky, Freescale Semiconductor, Inc, Austin, TX
Symposium Vice General Chair, Steering Committee, Device Design Program Chair, Education Committee, Education Council
John Kinnear, IBM, Poughkeepsie, NY
ESDA Board of Directors, TAS, STDCOM, Facility Certification Business Unit Manager, Nominations Committee, Awards Committee, WG 17, WG 20, WG 53
Vladimir Kraz, 3M, Soquel, CA
WG 3, WG 10, WG 17
James Krzmarzick, SAIC / NASA, Houston, TX
Education Committee
Hans Kunz, Texas Instruments, Dallas, TX
Technical Program Committee
Moon Lee, Semtech, Camarillo, CA
WG 14, WG 5.6
Raivo Leeto, Sandia National Laboratories, Albuquerque, NM
Steering Committee
JunJun Li, IBM, Essex Junction, VT
Technical Program Committee, Steering Committee
Dimitri Linten, IMECvzw Belgium, Leuven, Belgium
IEW Committee, Technical Program Committee
Tim Maloney, Intel Corporation, Santa Clara, CA
JWG CDM, WG 5.5, WG 14, Nominations Committee, Awards Committee, Technical Program Committee
Markus Mergens, Infineon Technologies, Neubiberg, Germany
IEW Committee
Tom Meuse, Thermo Fisher Scientific, Lowell, MA
JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, STDCOM
Jim Miller, Freescale Semiconductor, Austin, TX
Technical Program Committee, IEW Committee
Thomas Miller, Pace Worldwide, Annapolis Junction, MD
WG 5.6, WG 13
Dionyz Mishra, IBM, Essex Junction, VT
Technical Program Committee
Souvick Mitra, IBM, Essex Junction, VT
Technical Program Committee
Thomas Mohler, Raytheon TI Systems, Dallas, TX
WG 97
Gene Monroe, NASA-LARC, Hampton, VA
WG2, WG3, WG 11, WG 14, WG 20.20, STDCOM
Kathy Muhonen, Penn State Behrend, Erie, PA
ESDA Board of Directors, Education Committee, Curriculum Implementation Chair, Education Council
Andy Murello, Cocoa, FL
Steering Committee
Carl Newberg, Microstat Labs, Rochester, MN
STDCOM, TAS, Facility Certification
Guido Notermans, STEricsson, Zurich, Switzerland
Technical Program Committee, IEW Committee
Takayoshi Ohtsu, Hitachi Global Storage Tech, Kanagawa, Japan
Technical Program Committee
Motosugu Okushima, NEC Electronics, Kawasaki, Japan
Technical Program Committee
Dale Parkin, Seagate Technology, Shakopee, MN
STDCOM, WG 2, WG 3, WG 4, WG 9, WG 11, WG 17, WG 20, WG 97, Human Resources Committee, Nominations Committee, Steering Committee
Nathaniel Peachey, RF Micro Devices, Greensboro, NC
ESDA Board of Directors, Education Committee, Advanced Topics Business Unit Manager, STDCOM, Technical Program Committee, Marketing & Communications Committee, TAS, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14
Roger Peirce, SIMCO Electronics, Hatfield, PA
WG 3, WG 17, STDCOM
Tom Pelc, SUN, Newark, CA
WG 53
Rainer Pfeifle, Wolfgang Wambier, Hilzingen, Germany
Technical Program Committee
Paul Phillips, Phasix ESD, Hampshire, GREAT BRITAIN
JWG HBM, JWG CDM, WG 5.5, WG 5.6, WG 14
Dionyz Pogany, Vienna University, Vienna, Austria
Technical Program Committee
David Pommerenke, Missouri University of Science and Technology, Rolla, MO
Technical Program Committee
Claude "Bubba" Powers, Cooper Hand Tools-Weller Division, Apex, NC
WG 13
Donn Pritchard, Monroe Electronics, Lyndonville, NY
ESDA Board of Directors, EXCOM, Treasurer, Marketing & Communications Committee, Nominations Committee, STDCOM, Steering Committee, WG 3, WG 10, Human Resources Business Unit Manager
Brian Retzlaff, Plexus, Neenah, WI
WG 16, WG 20, WG 53
Bill Reynolds, IBM, Essex Junction, VT
WG 5.4, WG 5.6, WG14
Corrine Riche, STMircoelectronics, Agrate Brianza, Italy
IEW Committee
Bill Ricker, Ricker Engineering Services, San Marcos, TX
WG 16
Alan Righter, Analog Devices, Wilmington, MA
STDCOM, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG14, Technical Program Committee
Donna Robinson-Hahn, Fairchild Semiconductors, South Portland, ME
Technical Program Committee
Elyse Rosenbaum, University of Illinois at Urbana-Champaign, Urbana, IL
IEW Committee
Christian Russ, Intel Mobile Communications, Munich, Germany
Technical Program Committee
Jeff Salisbury, Flextronics, Austin, TX
STDCOM, WG1,WG 10, WG 11, WG 16, WG 53
Sandeep Sangameswaran, IMEC vzw Belgium, Leuven, Belgium
Technical Program Committee
Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan
JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 14
Mirko Scholz, IMECvzw, Leuven, Belgium
JWG HBM, JWG CDM, WG 5.4, WG 5.6, Technical Program Committee
Karen Shrier, Electronic Polymers, Inc., Round Rock, TX
WG 5.3.1, WG 5.6, WG 14
Jeremy Smallwood, Electrostatic Solutions , Hampshire, Great Britain
Technical Program Committee
Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands
Technical Program Committee, Steering Committee, IEW Committee, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6
Wolfgang Stadler, Intel Mobile Communications, Munich, Germany
Technical Program Committee, STDCOM, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 14, WG 17
Arnie Steinman, Electronics Workshop, Berkeley, CA
STDCOM, WG 3, WG 10, WG 17
Michael Stevens, Freescale Semiconductors, Tempe, AZ
JWG HBM
David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX
ESDA Board of Directors, Past-President, EXCOM, TAS, Human Resources Committee, Nominations Committee, Awards Committee, STDCOM, Technical Liaison Team, WG 2, WG 3, WG 10,WG 11, WG 17, WG 20
Augusto Tazzoli, University of Pennsylvania, Philadelphia, PA
Technical Program Committee, IEW Committee
David Tremouilles, LAAS/CNRS, Toulouse, France
Technical Program Committee, IEW Committee
Dale Tucker, Floorfolio/Responsive Flooring, Atlanta, GA
WG 7, WG 97
Julius Turangan, Ovation Inc., Livermore, CA
STDCOM, WG 2, WG 3, WG10, WG 11
Benjamin Van Camp, SOFICS BVBA, Aalter, Belgium
Technical Program Committee
Vladislav Vashchenko, Nat'l Semiconductor Corp, Santa Clara, CA
Technical Program Committee
Vesselin Vassilev, Novorell Technologies, Dallas, TX
Technical Program Committee, Steering Committee
Bob Vermillion, RMV Technology Group, LLC, Moffettfield, CA
STDCOM, Human Resources Committee, Nominations Committee,WG 2, WG 3, WG 4, WG 7, WG 11, WG 13, WG 15
Toni Viheriakoski, Cascade Metrology, Lohja, Finland
Technical Program Committee
Steve Voldman, South Burlington, VT
Human Resources Committee, Technical Liaison Team, Technical Program Committee, JWG HBM, WG 5.1, WG 5.4, WG 5.5, WG 5.6, WG 14
Scott Ward, Texas Instruments, Dallas, TX
STDCOM, JWG HBM, WG 5.2, JWG CDM, WG 5.4, WG 5.5, WG 5.6, WG 12, WG 14
Stan Weitz, Electro-Tech Systems, Inc., Glenside, PA
WG 11, WG 15
Terry Welsher, Dangelmayer Associates, Suwanee, GA
ESDA Board of Directors, Sr. Vice President, EXCOM, Education Committee, Technical Liaison Team, Marketing & Communications Committee, Education Council, Nominations Committee, STDCOM, JWG HBM, WG 5.2, JWG CDM, WG 17, IEW Committee
Joost Willemen, Infineon Technologies, Neubiberg, Germany
Technical Program Committee, IEW Committee
Heinrich Wolf, Fraunhofer IZM, Munich, Germany
Technical Program Committee
Gene Worley, Qualcomm Inc., Irvine, CA
Technical Program Committee
Shinishi Yamaguchi, Trek, Japan KK, Tokyo, Japan
Technical Program Committee
Kep Pen Yan, Infineon Malaysia, Melaka, Malaysia
Technical Program Committee
Joshua Yoo, Core Insight, Inc. Gyeonggi-do, South Korea
WG 3, Threshold Editorial Advisor
Craig Zander, Prostat Corporation, Edina, MN
STDCOM, WG 3, WG 11
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