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JWG – Human Body Model (HBM) Device Testing

Documents:

Working Group Chairs:  Terry Welsher, Dangelmayer Associates; Scott Ward, Texas Instruments, Inc.

 

Summer 2018 Virtual Meeting

Agenda items for the meeting on June 27, 10:00 AM – 11:30 AM EDT are:

Pending

 



April 2018 Face-to-Face

Summary of meeting activities:
An update was presented on monatomic HBM waveforms and a proposal was made for a modification to the ANSI/ESDA/JEDEC JS-001 requirements to allow more sophisticated ways of waveform parameter extraction. The group discussed out of spec 500-ohm waveforms using adapter boards and a 10K shunt on relay-based testers. There was also a discussion on how to stress products with “exception pins” (i.e., pins with higher or lower thresholds than the majority of the pins). This proposal was driven by the work in WG 5.0 on reporting recommendations in data sheets. A few methods were proposed and there is a plan to have this topic covered in the next revision of ANSI/ESDA/JEDEC JS-001. The status of the user guide for ANSI/ESDA/JEDEC JS-001 was reviewed and it is expected to be published at the same time as the next revision of ANSI/ESDA/JEDEC JS-001.


Winter 2018 Virtual Meeting
The joint working group reviewed the current status of ESDA/JEDEC JWIP-001. A discussion was held on current parking lot and new items for inclusion in the five-year update to ANSI/ESDA/JEDEC JS-001. This included a discussion on die attach exposed pads and how to curve trace them. There was also a discussion on a new item related to how to HBM stress products with known weak pins (e.g., RF pins). There was a concern raised due to the new datasheet standard practice currently being developed in WG 5.0. This topic will be discussed at future meetings.


September 2017 Face-to-Face Meeting
Agenda items for the meeting on September 7, 2017, 1:00 – 5:00 PM MST are:

  1. Introductions and Agenda Review
  2. Review of Standards Meeting Policies
  3. Status SPWIP 5.1.4  – Status
  4. Non-monotonic Waveforms - Status
  5. Other Topics
    1. Exposed Pads 
    2. Devices with 10 pins or less
    3. Definition of “pin”
    4. User Guide
    5. Walk-on Items

 


Summer 2017 Virtual Meeting
Summary of meeting activities
The joint working group discussed the treatment of exposed pads and the steps required to include the subject in the next revision of ANSI/ESDA/JEDEC JS-001. The committee is still exploring how to classify exposed die attach pads that use non-conductive adhesive. The joint working group also discussed a definition of “pin” and a recommendation on how to stress ICs with 10 pins or less. There was a brief discussion on the status of the user guide for ANSI/ESDA/JEDEC JS-001; a revision is expected soon.

Agenda items for the meeting on July 18, 2017, 1:30 – 3:00 PM ET are:
a.      Review of HBM Joint Working Group
b.      Status SPWIP 5.1.3 – Status (published)
c.      Status SPWIP 5.1.4 – Evan – Status
d.      Non-monotonic Waveforms - Team report if applicable
e.      Continue discussion of topics from Tucson face-to-face
• Exposed Pads – Subcommittee Report (There is consensus that these pads, if connected, should be treated like any other pin.
• Devices with 10 pins or less
• Definition of “pin”
f.       Walk-on Items


April 2017 Face-to-Face Meeting
Summary of meeting activities
The joint working group discussed a new document, ESD WIP5.1.4 - HBM testing – random sampling of power pins.  A discussion focused on HBM testing using a two-pin tester and methods to address devices with a number of power supply groups connected on the die only. The joint working group also held in-depth discussions on future additions to ANSI/ESDA/JEDEC JS-001 including exposed pads and stress guidance for low pin count devices (ICs <10 pins, discrete devices).

Agenda items for the meeting on April 29, 2017, 8:00 AM – 12:00 PM MT are:
a.      Status of JS-001 Limited Ballot
b.      Status SPWIP 5.1.3 - Wolfgang
c.      Status SPWIP 5.1.4 - Evan
d.      Non-monotonic Waveforms - Team report
e.      Topics for future Revision– Scott Ward
                           i.          IC test all possible pin combination for 10 pins or less
                          ii.          Table 1 w.r.t. ringing of 500 ohm load
f.       Walk-on Items


Winter 2017 Virtual Meeting
Summary of meeting activities

The joint working group adjudicated STDCOM vote comments on the limited ballot revision of JS-001. The document is expected to be submitted for industry review prior to the April meeting series. A discussion was held on the current status of the non-monotomic waveform analysis and simplification of decay constant determination.

JWG HBM Agenda items for the meeting on Monday, January 30,11:00 AM - 12:30 PM ET are:

  • Brief review of Joint Working Group
  • Status of JS-001 Limited Ballot                           
    •  Adjudicate STDCOM comments
    • Schedule
    • Status SPWIP 5.1.3
    • Status SPWIP 5.1.4
    • Non-monotonic Waveforms - Team report
    • Simplification of Decay Constant Determination
    • “Short all pins” option.  Add something in revision? Impact on two-pin testing?
    •  Walk-on Items

September 2016 Face-to-Face Meeting
Summary of meeting activities

The joint working group reviewed comments from the JEDEC JC10 limited ballot for ANSI/ESDA/JEDEC JS-001. A proposal presentation was given for a standard practice on pin selection using sampling for the terminal B pins during stress using a two pin tester. Technical considerations on non-monotonic HBM waveforms and “exposed pads” were also discussed. Both topics will be explored further in more detail during upcoming meetings.


Summer Virtual Meeting
Summary of meeting activities

An introduction to HBM JWG and past work / work in progress was presented. The committee reviewed the status of the ANSI/ESDA/JEDEC JS-001 limited ballot and reworked the schedule for a goal of publishing in December 2016. The working group also reviewed the status of ESD WIP5.1.3, a standard practice for random pin pairs, and a new proposal for a standard practice on two-pin testing improvements.


April 2016 Face-to-Face Meeting
Summary of meeting activities

The committee discussed the newest revisions to ANSI/ESDA/JEDEC JS-001 regarding failure windows. The document updates will be submitted to the technical and administrative support (TAS) committee immediately following the April meeting series. The goal is to submit a final document to the ESDA Standards Committee (STDCOM) and JEDEC’s JC14.1 for vote in May.

The joint WG also discussed a proposal for multiple pin supply pin groups shorted on the die only. There are concerns about the 10-90% rise-time measurement method so a small sub-group has been formed to analyze the issue and report back to the full team prior to the next teleconference.

Agenda
Saturday, April 16, 8 am - 12 PM agenda items are:

  1. Next Revision JS-001 – Some additional details to work out
    Failure Windows and Definitions
    Schedule Revision
  2. Other on-going work
    Random Pin Pair Selection Status (SP5.1.3)
    Simplifying testing I/O to supply for two-pin testers - Evan
    User Guide
  3. Year in Review – HBM/LU
  4. Walk-On Items
  5. Next Teleconference

Winter 2016 Virtual Meeting
Summary of meeting activities

The committee discussed the addition of “less than 50 V” allowance during the next revision of ANSI/ESDA/JEDEC JS-001. A proposal was presented for multiple pin supply pin groups shorted on the die only. A brief history of the WG was also presented for new meeting attendees.