For information regarding the Advanced Topics Committee please contact Michael Khazhinsky (Chair)
- Identify technical areas presenting growth opportunities for EOS/ESD Association, Inc. (areas ESDA should be involved in but is not at the moment)
- Lead, strengthen, and coordinate new EOS/ESD Association, Inc. program offerings by closely working with
- Education BU (new tutorials)
- Symposium and IEW BU’s (new workshops, invited papers, poster sessions)
- Standards BU (new standard development)
- Academia/University (novel topic incubator)
- Marketing (partner organizations)
- Alessio Griffoni (LED WG)
- Charvaka Duvvury (Academia)
- Terry Finn (Marketing)
- Harald Gossner (Marketing)
- Michael Khazhinsky (Chair)
- Tim Maloney (Academia)
- Souvick Mitra (IEW)
- Nicolas Nolhier (Academia)
- Nate Peachey (Standards)
- Lisa Pimpinella (ESDA HQ)
- Alan Righter (Events)
- Mirko Scholz (Chair)
- Wolfgang Stadler (Education)
- Michael Stockinger (Compact Modeling WG)
- Terry Welsher (Standards)
Areas/Topics of Interest being Developed
- IP Design House Interface Requirements
Ad hoc WG
Harald Gossner, Peter de Jong, Fabrice Blanc
Two meetings to define the outline of the reduced scope paper took place. The paper will be used as a teaser.
- LED Lighting
"The group is preparing the White Paper on the LED Lightning challenges in ESD and EOS.
Multiple EOS/ESD LED challenges from semiconductor die up to lighting system:
a common understanding of such issues is the goal.
Many LED EOS/ESD concerns are common with the rest of the industry.
Most differentiating problems are on application /board rather than component level,
even though failure mechanisms could be different than in silicon devices.
ESD part is being addressed first with the goal to have the first paper draft by summer.
The ESD part will cover (1) chip component level ESD (mostly finished);
(2) LED modules, and system level (draft by May/June). The group holds monthly web meeting.
The next opportunity for the face-to-face meeting will be at 2017 EOS/ESD Symposium.
- ESD SPICE/Compact Modeling
Preliminary TR outline has been proposed.
Some of the section owners have been identified and initial write up has started.
IEW 2017 featured invited talk on the subject, Interacting with Si2 CMC - current focus is on diode modeling.
Topics for future development
- Advanced Semiconductor Technologies and Beyond (carbon nanotubes [CNT] electronics, etc.): integration, manufacturing aspects, etc.
- ESD Aspects of Nanotechnology (beyond 5nm): gate-all-around structures in Si, Si+.
- ESD/EOS and IoT: system aspects, robustness requirements.
The topic has been discussed at IEW 2017. The plan is to build advisory board on the subject. Harald is leading the effort and soliciting participation from the University of California, Irvine and considering other universities and research institutes (University of Michigan, Fraunhofer). The plan is to have few teleconferences throughout the summer, a kick off meeting at 2017 ESD Symposium with the goal to have the workshop on robustness for IoT at 2018 ESD Symposium.
- ESD of Large Area Electronics (big screens, touch screens, polymer, electronics on glass)
- Integrated RF Front End (switches, LNA, PA, tunable filters).
Emerging seminar on related subject took plave at 2015 ESD Symposium
- Very HV Transistors (kV, IGBT, etc.) – EOS issues
- Electric Cars (Tesla, etc).
- Medical Devices
- System Level (Telecom)
- Biometric Devices
- MEMS (Discrete)
- HV LDMOS Devices (BCD technologies, etc.)
Exploring further interactions with the EMC Society
- Electrical Overstress (EOS)
Two existing EOS standards group led by Terry (Best Practices) and Reinhold (Root Cause Analysis) are active but may not cover system design and FA EOS aspects. EOS board/system design requirements is the topic of interest for this task. The sub-topic could be AMR (absolute minimum/maximum rating) and how one can define it. EOS subtask 1.6 was proposed with the focus on EOS physical failure analysis aspects, electrically induced physical damage signatures in general, the use of correct terminology consistent with Chapters 1 and 2 of EOS White Paper, EOS case history and classification. The goal is to outreach to FA community, establish communication with FA engineers, bring awareness of the existing EOS white paper and expand it into FA area. Need to find topic leader.
- 3D ICs
James Karp gave a presentation on this topic at the 2017 IEW
- ESD/EOS FOS (From Outside to Surface)
The topic was presented at 2015 IEW by Peter Jacob (Seminar and Discussion Group).
- Surge Stress (Automotive)
- Machine Learning: an Enabling Technique for Electronics Modeling and Design Optimization
Elyse Rosenbaum presented the talk on the subject at 2017 IEW
- Soft Fails
Harald Gossner presented the topic with the focus on latchup and noise-related soft fails.