EOS/ESD Association Journal - December 2023

EOS/ESD Association Journal EOS/ESD Association, Inc. Inside this issue Investigation on Fabrication - induced High - leakage Issue of an Overdrive ESD Power Clamp in Advanced FinFET Technology* Study of ESD Device Modeling Based on Neural Network* Advanced CDM Simulation Methodology for High - Speed Interface Design* Analysis of Input Receiver Transistors Be- havior during a CDM Event* Solutions To Improve HBM ESD Robust- ness of GaN RF HEMTs* Die - to - Die ESD Discharge Current Analy- sis* Automatic Creation of TVS SPICE Models for ESD System Level Simulations** Comprehensive Investigations of HBM ESD Robustness for GaN - on - Si RF HEMTs** RESURF Region Variation Induced Current Crowding Effect on HV p - LDMOS** On - Chip Surge Protection Structure with High Surge Robustness for USB PD 3.1 Applications** Upcoming Challenges of ESD Reliability in DTCO with BS - PDN Routing via BPRs*** Optimization of SCR for High - Speed Digi- tal and RF Applications in 45 - nm SOI CMOS Technology** Collector Engineering of ESD PNP in BCD Technologies** Impact of Thin - oxide Gate on the On - Resistance of HV - PNP Under ESD Stress** Analyzing Repeatability During Air Dis- charge ESD Tests** ESD Behavior of RF Switches and Im- portance of System Efficient ESD De- sign** Characterization and Modeling of Spar- kless Discharge to a Touch Screen Dis- play** Early - Time Electromagnetic Pulse Re- sponse Validation of Surge Arrester Mod- els** The Year ’ s Most Significant ESD Papers The EOS/ESD Association presents the year ’ s most significant ESD papers presented at the most important conferences that cover ESD. These papers are what we consider to be best - in - class. Introduction EOS/ESD Association, Inc. reviews and evaluates papers in the spe- cific field of Electrostatic Discharge (ESD) that are presented at the world ’ s foremost conferences. This compilation comprises our se- lections. December 2023 Volume 2 All Papers are Reprinted with Permission © 2023 *EOS/ESD Association, Inc., **IEEE, or ***The Japan Society of Applied Physics