MarchApril 2009

Four In-depth Seminars by Industry Leading Experts I/O Design Concepts for the ESD Engineer ESD Robust System – IC Design Contribution ESD Design Challenges in State-of-the-Art Analog Technologies VFTLP Tester Overview and Device Electrical Characteristics Keynote Presentation Carbon Nanomaterials for Next-Generation Interconnects and Passives Twenty-four Technical Presentations and Posters Covering: Modeling and Simulation for ESD Design New Design Tools for ESD Advanced Device Phenomena On-chip ESD Protection Design Test Methods and Tester Effects System Level ESD Issues Open Poster Sessions Discussion Groups Special Interest Group (SIG) Meetings The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 25, No. 2 March/April 2009 In this issue www.esda.org From the President David E. Swenson, page 2 Standards Update, page 3 & 4 Symposium Exhibits, pages 5 & 6 Education News, pages 7 & 8 ESD on Campus, page 9 Spotlight, page 10 Q & A, page 11 Local Sparks, page 12 Calendar, page 13 Now Available! ESD Association Calendar, Including local chapter meetings, regional tutorials, IEW, symposium and more. Look for this Icon You can print this calendar and use it at your desk. It is a helpful reminder of upcoming courses and events. Visit the Association web site www.esda.org to download your 2009 calendar Y ou are cordially invited to attend and actively participate in the 2009 International Electrostatic DischargeWorkshop (IEW).ThisWorkshopprovidesauniqueenvironment forenvisioning,developing and sharing ESD design and test technology for present and future semiconductor applications. The Workshop will focus on robust design and test of ESD protection for state-of-the-art integrated circuits and systems as well as advanced semiconductor system on chip (SOC) and system in package (SIP) applications. Here you will closely interact with your peers at technical seminars and presentations, invited and open poster sessions, moderated discussion group meetings and special interest group (SIG) meetings. A ll workshop activities take place at the beautiful Stanford Sierra Camp and Conference Center. This rustic and relaxed mountain setting provides an atmosphere ideal for interactive learning and helpful discussions. T here shouldbeample timeavailable forone-on-oneexchanges in theposter sessionmixers, inter-session breaks and during the family style meals in the conference center dining room. As an added highlight, Wednesday afternoon is left free for hiking, boating, sports or relaxation. This exciting and well balanced program was put together specifically to address the needs and interests of ESD engineers for the benefit of their company. Both attendees and their organizations gain from this investment in learning. Be aware that spaceat theCamp is limited, soplease registerearly.Seeyouat the2009 IEW! www.esda.org 2009 International Electrostatic Discharge Workshop Stanford Sierra Conference Center, May 18-21, 2009, Lake Tahoe, CA IEW TechnicallyCo-Sponsored by Register Early and Save! IEW International ESD Workshop May 18-21, 2009 Stanford Sierra Camp Lake Tahoe, CA 2009 IEW Highlights Registrations are now being accepted for this year’s IEW! For complete information download the 2009 program and registration form at: http://www.esda.org/documents/ IEWProgram2009.pdf