JulyAugust 2013

The ESD Association newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 29, No. 4 July/August 2013 In this issue HRESHOLD TM Find us on Facebook, LinkedIn, and Twitter! Continued on page 4 WWW.ESDA.ORG EOS/ESD Association, Inc. Setting the Global Standards for Static Control! Symposium, page 1 From the President, pages 2-3 Device Stress Testing Certification, page 5 Q & A, page 6 Spotlight, page 7 Standards Meeting Schedule, page 8 Finnish ESD Association, page 9 Local Sparks, page 10 Standards Summary, pages 11-12 December RTP, page 13 Factory Symposium, pages 14-15 December RTP, page 16 Calendar, page 17 Photo Corner, page 18 The 35th Annual 2013 EOS/ESD Symposium, a valuable experience for you and your company! There are many benefits to attending this EOS/ESD Symposium; • The training and up to date technical knowledge gained by attending can help to reduce costs and increase your company’s revenues. • The contacts you meet at the Symposium can help to open new op- portunities for your company. • Discussing ESD issues with other industry professionals can help your company find solutions faster. • Gain professional development, job performance enhancement, and em- ployee motivation. • An opportunity to benchmark your op- eration against the practices of other companies. The EOS/ESD Symposium offers many opportunities to advance your ESD knowl- edge and learn from industry professionals. Technical Program: The technical program of EOS/ESD Symposium addresses upcoming chal- lenges in novel technologies, system ESD aspects and progress in ESD con- trol measures. Three ESD factory control sessions highlight advanced method- ologies to encounter the demanding constraints in manufacturing and testing environment such as increasing CDM sensitivity of parts. Besides many topics ranging from high voltage technology and extreme RF ESD design to novel ESD testing and characterization meth- ods, the presentations on IC protection concepts give insight into challenges of 3D package integration and beyond evolutionary CMOS technology. An ex- citing change in perspective of on-chip protection in relation to system level ESD has happened and EOS/ESD shows the most recent developments here. This extraordinary mix of the most up-to- date technical papers will allow the audi- ence to gain a comprehensive overview of hottest topics in the field. Authors Corner: Meet with the authors of technical papers presented and learn more about their research in a special authors corner follow- ing each technical session. The authors corner is a great spot to review the slides and discuss additional questions about the presentation and network with others who have the same interests.