MayJune 2014

On Campus , page 9 The EOS/ESD Association, Inc. newsletter, published for everyone with an interest in the understanding and control of electrostatic discharge. Volume 30, No. 3 May/June 2014 In this issue TM WWW.ESDA.ORG EOS/ESD Association, Inc. Setting the Global Standards for Static Control! Emerging Technologies, page 1 From the President, page 2 ESDA Nominations, page 3-5 Local Sparks, page 6 Q&A, page 6 ESDACertification, page 7 Standards WG Summary, pages 8-10 ESDA Spotlight, pages 11-12 Did You Know?, page 12 ESD and EMC Activities at LAAS- CNRS , pages 13-16 Online Training, page 17 Calendar, page 18 Photo Corner, page 19 Watch for the Threshold E-Newsletter by email! You are invited to attend the New Emerging Technology Seminars, Monday September 8th at This Year’s Annual EOS/ESD Symposium EOS/ESD Symposium September 7-12 at the Westin La Paloma in Tucson, AZ For the first time, emerging technology seminars are offered in addition to the regular tutorials at the 2014 EOS/ESD Symposium. The emerging technology seminars are targeted to experienced ESD designers and technologists who would like to learn more about upcoming technologies to better assess the impact on ESD design and ESD pro- tection concepts. They will provide a condensed and first hand overview of the technolo- gy with clear indications of ESD and reliability relevant aspects. This is a unique chance to get important information without needing to attend general semiconductor technolo- gy conferences. The two seminars below are being presented by leading experts in their field and will give the attendees an excellent insight into GaN and 3D IC technologies. NEW GaN-Based Devices: Technology, Physics and Reliability 1:00 p.m. - 2:30 p.m. Matteo Meneghini, University of Padova GaN-based transistors have recently demonstrated to be excellent devices for application in the RF and power conversion fields. This short course will review the technology, physics and operating principles of GaN-HEMTs; moreover, we will describe the mechanisms that limit the dynamic performance, the lifetime and the ESD robustness of these devices. A critical review of the most recent studies on these topics will be also presented. NEW Emerging Technology Seminar 3D IC Stack Integration 3:00 p.m. - 4:30 p.m. Bob Sankman, Intel 3D stacking of silicon integrated circuits, using through silicon vias as the interconnect, has been an active topic in the research community for more than a decade. As appealing as the technology is, it has yet to have garnered wide acceptance in high volume products. A brief history of the 3D architecture, practical issues in design, fabrication and assembly of components will be discussed along with a perspective on what’s to come in the future. 2014 EOS/ESD Symposium Registration is Now Open! www.esda.org/symposiaEOS-ESD.html