EOS/ESD ASSOCIATION, INC. MARCH/APRIL 2025 VOLUME 42, NO 2 THRESHOLD™ SETTING THE GLOBAL STANDARDS FOR STATIC CONTROL! 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
Dear Friends of the ESDA, My 2025 New Year’s Day started with an annoying alarm at 4:00 AM; I was catching a flight to Bangalore India for the VLSID 2025 conference. I attended because the Association wanted to explore what a co-located event like our IEW with this conference. The 38th VLSID conference attracted over 2500 people in total for the tutorials and the conference. The theme of the conference was “Silicon Meets AI: Sustainable Innovation in Accelerated Computing, Secure Connectivity, and Intelligent Mobility.” THRESHOLD™ MARCH/APRIL 2025 ACL Staticide 840 W. 49th Place, Chicago, IL 60609 Tel: 847-981-9212 Fax: 847-981-9278 info@aclstaticide.com • www.aclstaticide.com Manufacturer of anti-static topicals, dissipative coatings for plastic and floors, ESD workstation products including meters. ISO 9001:2008 certified QS CONTROLLED ENVIRONMENTS PO Box 779, Amherst, NH 03031 Tel:973-920-7000 Fax:603-672-3028 www.cemag.us web_ce@viconmedia.com Leading source of digital and print information on contamination prevention, detection, and control for cleanrooms and critical environments EOS/ESD Association, Inc, President Nathaniel Peachey From the President Many of the tutorials, invited talks, and panel discussions focused on themes such as novel technologies in FinFETs, 3D integration, and ways of designing the necessary hardware to support the AI revolution. In addition, there were industry leaders that gave keynotes on what AI would bring, not just for India, but for the global community. There were tutorials and talks on the use and development of large language models (LLM’s) and how AI at the edge was impacting electronic devices far beyond the large data storage and computing power that drives the heart of AI. The clear message from the conference was generative AI is THE current disruptive technology of today. Unlike previous disruptive technologies, it is not the AI itself that is as disruptive as the manner in which AI is transforming everything else in the digital world. If further indications of how disruptive developments in AI can be, one needs only to look back on the DeepSeek release of what is both an AI application and an open-source platform that allows developers to integrate DeepSeek's AI capabilities into their own applications. This immediately sent shock waves through both the high-tech and financial communities. What DeepSeek’s Liang Wenfeng was able to demonstrate was powerful AI models could be created with far less computing power than the industry thought necessary. The immediate effect was to send a broad range of tech stocks tumbling. While the industry leaders at VLSID 2025 could not have anticipated the tectonic shift that DeepSeek appears to have triggered, their theme of “Silicon meets AI” was uncannily timely.
However, I was not in India to learn about AI. I was there to discuss what the ESDA Events business unit proposed for VLSID-IEW events in 2026 and 2027. I had several discussions with one of the general chairs. While it quickly became apparent that trying to co-locate ESDA events with the VLSID conference would not be viable, the general chair impressed upon me the importance of developing a wholistic India strategy instead. An important takeaway from the conference was a snapshot of the Indian semiconductor industry and what Indian industry leaders hope it will look like going forward. Implicit in many of the keynotes was the role that India plays now and wants to play in the global semiconductor industry moving forward. While multiple multinational companies have design centers in India, there is no true end-to-end semiconductor ecosystem. Furthermore, with the exponential growth of AI and its applications, there is no future without embracing technological engagement at all levels of the AI hardware, software, and application space. And what the DeepSeek “sputnik moment” has demonstrated is the race does not necessarily go to the strong and the powerful. Rather, what is important is curiosity and a desire to create using Liang’s words. Transforming Technologies, LLC 3719 King Road, Toledo, OH 43617 Tel: 419-841-9552 • Fax: 419-841-3241 Email: info@transforming-technologies.com www.transforming-technologies.com Transforming Technologies provides unique and outstanding products to detect, protect, eliminate, and monitor electrostatic charges. IEST - Institute of Environmental Sciences and Technology 2340 S. Arlington Heights Road, Suite 100, Arlington Heights IL 60005 Tel: 847-981-0100 • Email: information@iest.com • www.iest.com As secretariat of ISO/TC 209, IEST offers ISO 14644 and ISO 14698 standards, as well as peer-approved standardized procedures, IEST Recommended Practices. THRESHOLD™ MARCH/APRIL 2025 Development of a wholistic and coherent ESDA strategy for India will start from my recent experience at the VLSID conference. Building on that, we will need to develop a strong partner team in India to help us further understand what precisely the needs are in India and what ESDA can address. Rather than starting by planning events, we will need to develop the various vectors of our engagement based on the realities in the country. Guiding all of this will be our vision and mission we developed over the last year. We have a passion to serve industry through collaborations and networking to build a reliable and equitable ecosystem in EOS/ESD mitigation. We are striving to becoming vital in supporting the Indian semiconductor aspirations. Building an equitable ecosystem means that we are committed to bringing state-of-the-art education, certifications, standards, and technical exchanges to the Indian semiconductor industry so that, even if they are coming from behind, they have the tools to build reliability into their industry, from research and development, to design, and then to ESD safe practices in factories. Warm regards, Nate Nate Peachey President of EOS/ESD Association, Inc.
THRESHOLD™ MARCH/APRIL 2025 A Message from our Senior Executive Director EOS/ESD Association , Inc., Sr. Executive Director Lisa Pimpinella Strategic Growth Plan: Strengthening Association-Partnerships and Collaborations: The focus of our recent Board of Directors (BoD) meeting was to define and reinforce one critical aspect of our growth strategy—strengthening our AssociationPartnerships and Collaborations. We recognize that partnerships are essential because they combine the expertise and strengths of organizations, enabling them to achieve greater impact, expand their audience, and accomplish goals that would be impossible individually. By leveraging each other’s resources and perspectives, partnerships create opportunities, close gaps, and foster innovation through collaboration. “Partnerships are essential because they combine the expertise and strengths of organizations, enabling them to achieve greater impact, expand their audience, and accomplish goals that would be impossible individually. By leveraging each other’s resources and perspectives, partnerships create opportunities, close gaps, and foster innovation through collaboration.” This statement will guide our efforts as we explore new alliances and foster deeper connections with our existing partners. Below is the exact text from our recent BoD meeting that outlines our creative activities and discussions, particularly emphasizing our volunteer engagement and team spirit: During our meeting we participated in some team development activities to celebrate our accomplishments of 2024 and strengthen our path forward for 2025. Here is the outcome of some of those activities. Volunteers - ESDA Fun: At BoD meeting we created what ESD can inscribe on a wall, ESDA Bumper Stickers, and why ESDA loves its volunteers. Why volunteers love ESDA: 1. We are passionate about working with a collaborative team to produce high-quality technical documents that ensure product reliability; while also taking pride in the impact we have on the global community. 2. We love the energetic way of interacting with other fellow engineers in resolving common ESD problems and stay up to date. Roadmaps and anticipating solving technical issues. ESDEMC Technology, LLC 4000 Enterprise Dr., Suite 103, Rolla, MO 65401 Tel: 573-202-6411 • Fax: 877-641-9358 www.esdemc.com ESDEMC Technology designs, manufactures, and markets ESD/EMC related products and consulting services. Thermo Fisher Scientific Inc. 200 Research Drive, Wilmington, MA 01887 Tel: 978-275-0800 • Fax: 978-275-0850 www.thermoscientific.com Leading manufacturer of semiconductor test equipment for the simulation of Electro Static Discharge (ESD), Latch-up, and TLP events. 3. Join a community of experts to share knowledge, mentor, collaborate, and build strategies while fostering growth, learning, and meaningful connections.
What ESDA does best: ESDA is the best at recognizing challenges and being resilient in defining solutions. What can ESDA inscribe on the wall: “For those about to shock we protect you, We won’t let ESD shock you.” What ESDA loves About volunteers: E--Efficient, everlasting, and experience S--Supportive, Sustainable, Steady D--Dedicated and Diverse A--Accommodating and Autonomous ESDA Bumper Sticker: Guardians of static electricity Zaps happen join the resistance MEGA Making ESDA great again MAGA Measure analyze Ground Always Make Antistatic great again While this shows some of the fun side we can have as a team the main focus was to identify things we are all passionate about and our creativity. As we determine our next program, products, and services, our volunteers as the experts in the industry will lead us forward. THRESHOLD™ MARCH/APRIL 2025 Leveraging Our Creative Outcomes: Team Building & Culture: The creative exercises—such as designing wall inscriptions and bumper stickers— reflect our vibrant culture. We will continue to use these initiatives to boost morale, enhance team cohesion, and generate innovative ideas that feed directly into our strategic programs. Volunteer Engagement: Our volunteers are recognized as industry experts. We will harness their passion and insights to lead the development of new programs, products, and services. This will involve establishing dedicated volunteer committees focused on innovation and technical excellence. RMV Technology Group, LLC, A NASA INDUSTRY PARTNER NASA Ames Research Center, Space Portal, Moffett Field, CA 94035 www.esdrmv.com and www.esdaerospacetraining.org Internationally Accredited ESD Product Qualification Laboratory The Exclusive iNARTE® Certified Space & Defense ESD Engineer Training Center 650-964-4792 or renee@esdrmv.com Proline 10 Avco Rd., Haverhill, MA 01835 Tel: 800-739-9067 Fax: 978-374-4885 www.1proline.com E-mail: Bench@1proline.com Manufactures ESD modular and ergonomic work benches
THRESHOLD™ MARCH/APRIL 2025 Expanding Strategic Partnerships: Mapping and Outreach: We will compile a list of potential partners whose expertise aligns with our mission. Outreach efforts will include joint workshops, networking events, and collaboration on white papers and technical documents. Formalizing Alliances: Using our guiding statement, we will develop formal agreements with selected partners. These alliances will be structured to maximize shared resources and ensure that both parties benefit from the collaboration. Communication & Evaluation: Internal Communication: We will maintain open lines of communication across the organization to ensure that every team member understands how their contributions feed into the larger strategic goal. Regular updates and feedback sessions will be scheduled. Performance Metrics: Success will be measured by the number of new partnerships established, volunteer engagement levels, project milestones reached, and the impact of our new products/services in the market. Our strategic focus on strengthening Association-Partnerships and Collaborations is built on the solid foundation of our team’s creativity, passion, and technical expertise. By leveraging the ideas and creative expressions captured during our recent BoD meeting—and by following the supporting actions outlined above— we are poised to achieve greater impact, drive innovation, and expand our global reach. The volunteer-led spirit of “ESDA Fun” will continue to be a guiding light as we navigate the challenges and opportunities of 2025 and beyond. All the best, Lisa Lisa Pimpinella Sr. Executive Director, EOS/ESD Association, Inc. Desco Industries Inc. 3651 Walnut Ave., Chino, CA 91710 www.Descoindustries.com • Tel: CA-909-627-8178• MA-781-321-8370 ESD Control Products & More. Our brands include: APR, Desco, Desco Asia, Desco Europe, EasyBraid, EMIT, ESDSystems.com, Menda, Protektive Pak, SCS, SpecialTeam, Statguard, TRONEX and US Toyo Fan. SelecTech, Inc. 33 Wales Ave, Suite F, Avon MA 02322 USA Ph: 508-583-3200 Fax: 877-738-4537 Email: info@selectechinc.com www.selectechinc.com Manufacturer of StaticStop interlocking flooring
THRESHOLD™ MARCH/APRIL 2025 The ESDA technology roadmap is developed and maintained by the Advanced Topics (AT) committee. The aim of the document is to support and guide the daily work of ESD and latchup engineers. The roadmap provides a glimpse into the future ESD thresholds of semiconductor devices and their impact on ESD control practices. It also presents future technical challenges in ESD and latchup. In the past the roadmap was updated every five years. In 2023 a yearly update was introduced to be up to date with the fast developments in our industry. The AT team has started the work on the 2026 edition of the roadmap. For this edition the part on ESD thresholds and the related control levels will get a major update. Until now the ESD threshold levels were given for a broad range of applications and technologies. This is misleading when looking at future ESD thresholds because of different product requirements in different applications. In the new edition, the threshold level will be provided independently for different applications such as consumer, automotive, or communication. Another update will be done in the outlook section and in the section on EDA to capture recent and upcoming developments in these areas. The AT team is always looking for additional volunteers. Particularly for the work on the roadmap we need a broad expertise and background to ensure that we provide a relevant document for the daily work of ESD and latchup engineers. Any background in ESD control, ESD and latchup design, and the related testing strengthens our team. If you are interested in joining the team you can either approach the ESDA staff or the AT co-chairs Mirko Scholz (mirko.scholz@infineon.com) and Shubhankar Marathe (shumars@amazon.com). Committee Spotlight Key Resin Co./Flowcrete 4050 Clough Woods Drive, Batavia, OH 45103 513-943-4225, Fax 513-943-4255 sales@keyresin.com www.keyresin.com Manufacturer of conductive and ESD resinous flooring and floor sealers. Key Resin West 1315 E. Gibson, Suite D., Phoenix, AZ 85034 602-523-9353, Fax 602-523-9349 SCS - Formerly 3M Static Control 914 JR Industrial Drive, Sanford, NC 27332 USA Ph: 919-718-0000 www.staticcontrol.com ESD control products: bags, floor tiles, foot grounders, ionizers, mats, testers & monitors, smocks, vacuums, wrist straps, Static Control Management and more.
ESDA’s Academia Committee promotes ESD research opportunities and engages future talent and development. The strategic goals set in 2024 were the ESDA Capstone Projects, Revision of the Lecture Packet, and the Datafile of students' ESD/LU publications. By the end of 2024, significant progress has been made in these three areas, with the successful completion of the first capstone project at Arkansas University, revision of the lecture packets, which is set to be released in February 2025, and the completion of the data file of all ESD student papers from 2021-2024. Based on these achievements, ESDA’s Academia Committee will continue implementing these strategic goals in 2025. Led by Dr. Shih-Hung Chen from AMD, the Capstone Project team plans to widen their exploration horizon and look for new topics and universities to work with. They are working towards a capstone project proposal to design LU test structures in mature CMOS technology. They are discussing the necessary infrastructures for the LU test board. Efforts are being made to explore the tape-out channels and costs of the designing process. In addition, collaborating with ESD control experts, the team will discuss potential topics of ESD environment control and search for suitable universities and professors to work with. This collaborative effort is expected to generate new insights into ESD and allow students to work on practical projects that will help hone their skills and build their confidence as professionals. The Capstone Project team is eager to work with universities and their faculty members to explore new academic horizons and inspire corresponding educations in ESD. The revised Lecture Packet, driven by Dr. Wen-Min Wu, from IMEC, will be available to download from the ESDA's academia committee webpage by the end of the first quarter 2025. This new version consists of two courses, basic and advanced, with six chapters in the basic course. Chapters 1 through 6 cover ESD basics, ESD protection devices, design concepts, control methods, latch-up scenarios, and system-level ESD basics. The advanced course consists of five chapters where chapter seven explores advanced ESD control and prevention methods, chapter eight covers advanced ESD design concepts, chapter nine explores ESD failure analysis tools for ESD and latch-up damages, chapter ten focuses on RF and high-speed I/O ESD protection, and chapter eleven covers aspects like CDM tester modeling, standard roadmap, EDA tools, and emerging technologies. This revised lecture packet aims to provide a comprehensive guide to ESD and help educate students and professionals. Last but not least, Mr. Prantik Mahajan, from Renesas, has led the Student Publication Tracing file, which aims to connect students with the academic research community in the field of ESD, and trace their publications. The publications have been categorized into three primary topics: ESD, latch-up (LU), and electrical overstress (EOS). The corresponding publications within the ESD category have been divided into sub-groups, including system, device, design, modeling, and testing. In 2025, the team aims to continue with tracing data for the upcoming year. Additionally, they plan to approach professors with high publications and introduce them to the ESDA community on the lookout for possible collaborations with academic institutions. This strategic goal is expected to increase the participation of students and academic researchers in ESDA activities. Spotlight on Academia’s 2025 Plans THRESHOLD™ MARCH/APRIL 2025 Core Insight, Inc. 186 Galmachi-ro, Seongnam-city, Gyeonggi-do, 13230, Korea Phone: +82-31-750-9200. Email: sales@coreinsight.co.kr: www.coreinsight.co.kr Steady-State DC Ionizer Manufacturer for BenchTop, Overhead, Nozzle, Gun, Air Assist, and Ceiling Ionizers Molded Fiberglass Tray Co. 6175 US Highway 6, Linesville, PA 16424 USA Ph: +1-814-683-4500 Fx: +1-814-683-4504 www.mfgtray.com Manufactures fiberglass reinforced plastic Fiberstat ESD products; trays, bins, totes, and mats
THRESHOLD™ MARCH/APRIL 2025 What’s New in 2025 for EOS/ESD Association Certification Programs? The semiconductor industry is a dynamic, ever-evolving field, driven by rapid technological advancements and the demand for innovation. With global semiconductor revenues projected to soar from $452.25 billion in 2021 to $803.15 billion by 2028—a staggering CAGR of 8.6%—the pressure is mounting for manufacturers to produce reliable, high-quality chips while addressing increasingly complex ESD challenges. To meet these demands, EOS/ESD Association Certification Programs are equipping engineers and professionals with cutting-edge expertise and practical tools to stay ahead. New in 2025: Process Assessment Certification – A First in the Industry The Process Assessment Certification is the EOS/ESD Association’s latest innovation, designed to empower professionals with the ability to execute robust ESD process assessments on the factory floor. Leveraging the guidelines outlined in ANSI/ESD SP17.1, this comprehensive certification combines the best of online learning with hands-on, instructor-led training: Flexible Learning: Begin with an online module that lays the groundwork for advanced ESD process assessments. In-Person Expertise: Participate in a three-day, interactive classroom experience led by two industry experts. Real-World Application: Learn how to identify and mitigate risks, such as charged personnel, ungrounded conductors, and electrostatic fields impacting Electrostatic Discharge Susceptible (ESDS) items. Certification with Impact: Gain industry-recognized credentials by passing a rigorous written and verbal examination. This first-of-its-kind certification ensures professionals are ready to tackle real-world ESD challenges, boosting productivity, quality, and reliability for semiconductor manufacturers. Level Up: The All-New ESD Design Engineer Certification 2 (EDEC2) Building on the success of EDEC1, the EOS/ESD Association is proud to introduce EDEC2, a certification tailored for ESD Design Engineers seeking to deepen their expertise. With this certification, engineers gain advanced insights into ESD device design, ensuring they are well-prepared to excel in a competitive industry. Comprehensive Curriculum: Includes 14 expert-led online courses, each followed by a knowledge assessment test to solidify learning. Affordable and Bundled Pricing: Gain access to the full suite of courses under one bundled price. Ongoing Excellence: Stay current with an annual recertification, ensuring your skills remain sharp and relevant. Achieving EDEC2 certification positions engineers as trusted experts, ready to tackle the complexities of ESD design and compliance. Enroll today and take the next step in your career! HPPI GmbH Stadlerstrasse 6A, D-85540 Haar, Germany Phone: +49 (0)89 / 878 06 98 – 443; www.hppi.de Development and sales of ESD Testers Hanwa Electronic Ind. Co., Ltd. 689-3, Ogaito, Wakayama, Japan 649-6272 TEL:+81-73-477-4435 • FAX:+81-73-477-3445 keiichih@hanwa-ei.co.jp • www.hanwa-ei.co.jp Full Automatic Wafer Level ESD Tester / HBM, MM, HMM, and SCM ESD Tester, TLP Tester/ CDM Tester/ Electrostatic Imaging System
THRESHOLD™ MARCH/APRIL 2025 Certifications to Meet Every Need Beyond our latest innovations, the EOS/ESD Association continues to offer a robust suite of certifications tailored to the needs of the manufacturing and design communities. Whether you’re looking to enhance your knowledge or elevate your team’s capabilities, we have a program for you: Manufacturing Certifications: Compliance Verification Technician to TR53: For those focused on compliance verification techniques. ESD Program Manager: Develop and implement comprehensive ESD control programs. ESD Program Associate: Foundational knowledge for ESD control team members. ESD Program Auditor: Learn how to assess and maintain compliance. Design Certifications: ESD Circuit Design (ECEC): Advanced techniques for ESD circuit development. ESD Device Stress Testing: Critical training for evaluating device robustness. Why Choose EOS/ESD Association Certifications? Industry Leadership: With decades of experience, the EOS/ESD Association is a trusted name in ESD control, serving as the gold standard for certifications. Practical Knowledge: Our programs emphasize real-world application, ensuring participants can immediately translate their learning into impactful results. Career Advancement: Stand out in a competitive industry with credentials recognized globally. Comprehensive Support: From foundational courses to advanced certifications, we offer a clear path for career growth. Take the Next Step Today Whether you’re aiming to lead process assessments, design robust ESD systems, or enhance your team's capabilities, EOS/ESD Association Certification Programs provide the tools and knowledge to succeed. Visit esda.org to explore our full suite of certifications and enroll in your next course today. Don’t wait—invest in excellence and join the ranks of ESD experts shaping the future of the semiconductor industry. Simco-Ion, Technology 1141 Harbor Bay Pkwy, Ste 201, Alameda, CA USA 94502 (800) 367-2452 (510) 217-0600 ioninfo@simco-ion.com www.simco-ion.com/technology Simco-Ion has been the world’s largest provider of solutions for static charge control for over 40 years. Products include ionizing bars, ionizing blowers, in-line ionizing products with balance control as low as ±1V, Novx real-time monitors and ESD event detection. BARTH ELECTRONICS, INC. 702.293.1576 Original Equipment Manufacturers of: CMT Generator, TLP+, VFTLP+, and HMM+ Test Systems Please see barthelectronics.com for more info on our products. 1589 Foothill Drive, Boulder City, NV USA 89005 beisales@barthelectronics.com Since 1964
THRESHOLD™ MARCH/APRIL 2025 2025 ESDA Events EOS/ESD Association Inc. has scheduled several events for 2025. The premier event, the EOS/ESD Symposium, will be held from September 13-18 in Riverside, CA, USA. This Symposium is a key event for professionals working in the field of electrostatic discharge (ESD) and electrical overstress (EOS). It features cutting-edge research and innovative solutions presented by leading experts from around the world. Attendees can look forward to a comprehensive program that includes keynote addresses, technical sessions, workshops, and networking opportunities aimed at promoting collaboration and knowledge exchange. The US International ESD Workshop (IEW-US) will be held in conjunction with the IEEE International Reliability Physics Symposium (IRPS), a conference for engineers and scientists to present new work in microelectronics reliability. The IEW will take place April 1-April 3 in Monterey, CA, USA. Attendees registered for IEW-US can participate in the full IRPS technical program, including technical sessions, invited talks, keynote speakers, and the joint evening poster reception. IRPS registrants will have access to IEW keynote and invited talks, excluding other unique elements of IEW-US. IEW-US will include features such as invited speakers, seminars, poster sessions, discussion groups, and opportunities to network and explore the area. As in previous years, the IEW will continue to provide an environment for presenting new work and discussing current issues in the ESD and EOS communities. For the first time this year, the ANSI/ESD S20.20 Seminar will be held April 23-24 in Bangalore, India. This seminar covers designing and implementing an ESD control program based on the latest ANSI/ESD S20.20 release and prepares participants for ESD facility audits. It is essential for in-plant auditors and program managers seeking ESDA certification. The European International ESD Workshop (IEW-Europe) will be held in Zagreb, Croatia May 12-16. IEW-Europe offers a platform for presenting research and discussing electrostatic discharge (ESD) and electrical overstress (EOS). The program features tutorials, seminars, technical sessions, invited speakers, and discussion groups. The workshop emphasizes discussion groups and notable speakers, alongside traditional tutorials and seminars. Technical sessions include five-minute teaser presentations followed by interactive poster discussions. This year’s focus areas are IC design, chip-level and system-level ESD, EDA, automotive applications, failure analysis, EMC, testing, and advanced technologies. Keynote and invited speakers will highlight recent advancements in ESD. ESDA will continue its collaboration with various conferences and organizations, presenting ESD-focused content. At the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) August 5-8 in Penang, Malaysia, C.S. Tay (Canmax) will deliver an invited talk on “Electrostatic Discharge - Improving Electronic Device Yield and Reliability”. During the IEEE International Symposium on Electromagnetic Compatibility + Signal Integrity and Power Integrity (EMC + SIPI) Aug. 18-22 in Raleigh, NC, USA, Hans Kunz (Texas Instruments) will lead a workshop on “Direct-to-pin Component-Level ESD Testing Using System-Level ESD Standards and Equipment”. This symposium will also feature a dedicated ESD session. In 2025, the EOS/ESD Association Inc. will co-sponsor the Custom Integrated Circuits Conference (CICC) and the Chiplets Solutions for Custom IC Design (CHISIC) workshop from April 13-17 in Boston, MA, USA. Additionally, they will co-sponsor the International Symposium for Testing & Failure Analysis (ISTFA) November 16-20 in Pasadena, CA, USA. NRD, LLC 2937 Alternate Boulevard, Grand Island, NY 14702 716-733-7634, Fax 716-773-7744 sales@nrdllc.com www.nrdllc.com NRD, LLC is recognized as a global leader in the field of static elimination using non-electrical nuclear ionization. The company is dedicated to developing and manufacturing static control technologies including advanced solutions utilizing Alpha and Beta emitters that meets regulatory requirements of sealed source technology. Grund Technical Solutions 393-J Tomkins Ct. Gilroy, CA 95020, USA Phone: +1-408-216-8364 x103 Email: sales@grundtech.com https://www.GrundTech.com Manufacturer of ESD Test equipment for devices and wafers including PurePulse 2pin set-up for HBM, MM, TLP and VF-TLP. Titan for independent device HBM testing. Test House Services with true 2-pin ESD Verification.
THRESHOLD™ MARCH/APRIL 2025 Upcoming Events Botron Company, Inc. 21601 N. 21st Ave Phoenix, AZ 85027 Phone: (623) 582-6776 Fax: 623-582-6700. https://www.botron.com Industry-leading ESD compliance automation. Estatec LLC 8175 Saint Andrews Ave. San Diego, CA 92154 Phone: (619) 934-8759 https://usa.estatec.com/ casales@estatec.com
THRESHOLD™ MARCH/APRIL 2025 Iona TECH 164 Society Dr. Unit O Telluride, CO 81435 Phone: (510) 684-9374 https://www.iona.tech/ info@iona.tech ERGOFORM, S.A. DE C.V. Av. Palmas Nte. 562, Bellavista 62140 Cuernavaca, Morelos, Mexico Phone: +52.777311.6970. Fax: +52.777.311.666 Email: info@ergoform.com.mx https://wwwergoform.com.mx ERGOFORM is the leading Industrial, Manufacturing and Technical chair ESD manufacturer for 34 years focusing on the endusers health and the erdonomics and durability of our products.
THRESHOLD™ MARCH/APRIL 2025 WORK SURFACES CORPORATION 47 East Highland Ave.Unit B, Sierra Madre, CA 91024 Phone: +1.626.485.2555. Email: bp@worksurfaces.com https://worksurfaces.com/ We make solid brass ESD grounding systems for electronic workstations. We sell custom ESD equipment covers, wrist straps, ground cords, ect. SIKA CORPORATION 201 Polito Ave Lyndhurst, NJ 07070, USA Phone: (844) 529-7101 Email: info.flooring@us.sika.com www.sikafloorusa.com Sika Corporation is a global leader with over 100 years of experience in building materials and restoration technologies. Sika's seamless floor and wall systems are trusted and relied upon for their performance, durability and aesthetics.
THRESHOLD™ MARCH/APRIL 2025 Tru Vue, Inc. 9400 W. 55th St. McCook, IL 60525, USA Phone: (740) 789-0623 Email: chanderson@tru-vue.com www.tru-vue.com Tru Vue is a leading manufacturer of ultra clear ESD-safe plastics, offering high-performance solutions. With over 80 years of expertise, Tru Vue provides advanced TRU-ESD™ acrylic and polycarbonate solutions for effective safety and contamination control. EOS/ESD Association Services, LLC 218 W Court St Rome, NY 13440, USA Phone: +1.315.339.6937. Email: lpimpinella@esda.org https://www.esda.org/eosesd-association-services-llc/ ESD Control Program Plan Development assistance, Preassessment to ANSI/ESD S20.20, auditing, and more.
THRESHOLD™ MARCH/APRIL 2025 Your company could be here! Contact info.eosesda@esda.org to find out how to advertise your company in the Bi monthly Threshold. Your company could be here! Contact info.eosesda@esda.org to find out how to advertise your company in the Bi monthly Threshold.
THRESHOLD™ MARCH/APRIL 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
Tech Talk: Sparks of Disaster: Real-World Tales of Manufacturing ESD Failures Join us for a captivating town hall-style tech talk where a panel of seasoned experts share their firsthand experiences with Electrostatic Discharge (ESD) failures in the electronics industry. This engaging discussion will go beyond theory, delving into real-world case studies with visual examples of damaged components and insightful analysis of ESD symptoms (catastrophic, latent, and soft failures). Our esteemed panel includes: Dave Girard, Staticon Support Services, Inc. Dave Swenson, Affinity Static Control Consulting, L.L.C. John Kinnear, EOS/ESD Association, Inc Matt Strickland, Boeing Prepare for an enlightening session where these experts recount their "war stories" with ESD, offering valuable lessons learned and practical insights applicable to factory control and beyond. The interactive format encourages audience participation, fostering a dynamic exchange of knowledge and perspectives. Don't miss this opportunity to learn from the best and fortify your understanding of ESD's critical impact on electronic systems. THRESHOLD™ MARCH/APRIL 2025 Emerging Professionals: Tech Talks May 6, 2025 01:00 PM Eastern Time (US and Canada) Register online for this complimentary talk: https://us02web.zoom.us/meeting/register/b4ggIrERf6SsDhOTDD8ew 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
2025 International ESD Workshop (IEW) Announcement Monday 12 May - Friday 16 May 2025 Hotel Dubrovnik, Gajeva ulica 1, Zagreb, Croatia THRESHOLD™ MARCH/APRIL 2025 • IC design • Chiplet-level ESD • Chip-level • System-level ESD • EDA • Automotive • Failure analysis • Testing • Advanced technologies • ESD control and process assessment • Novel ESD protection circuits • ESD circuit simulation/modelling • Physics of ESD • Novel ESD testing methods • Technology integration for ESD • Electrical overstress (EOS) • Correlation between EMC and ESD • Statistical ESD data In its 18th year and in collaboration with the EOS/ESD Symposium, the International ESD Workshop (IEW) offers a relaxed setting for presenting new work and discussing Electrostatic Discharge (ESD) and Electrical Overstress (EOS) issues. Next to tutorials and seminars, this time there will be a greater focus on discussion groups and invited speakers. Technical sessions include fiveminute teaser presentations followed by interactive poster discussions. https://www.esda.org/events/2025-international-esd-workshop-iew-europe/ Focus Topics Other Submission Topics Workshop Description Location Zagreb, capital of Croatia Hotel Dubrovnik, at the main square 20 minutes from international airport www.hotel-dubrovik.hr 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
Focus Topics Other Submission Topics Location Karim T. Kaschani, Robert Bosch GmbH While electrostatic charging and electrostatic discharges (ESD) are among the oldest physical phenomena on earth, they drew attention to the design of integrated circuits due to unexpected device failures just about 45 years ago. We have learned a lot about ESD control and ESD protection since then. However, we are still often surprised to see that our expectations turn out to be wrong and that there is so much more to learn. This keynote reviews some of these expectations and surprises taken from the different branches of the extremely diverse fields of ESD and EOS. Karim T. Kaschani received his Ph.D. for his research in the field of semiconductor power devices in electrical engineering from the Technical University in Brunswick in 1996. He worked for almost eight years for Siemens Semiconductors and Infineon Technologies as a development engineer and project leader in advanced ICs for switch-mode power supplies. He also worked on concept engineering of high-voltage SOI technologies and developing high-voltage ICs. Afterward, he joined Atmel Automotive and worked for almost 7 years as head of the ESD test and consulting group and as product quality engineering manager. Thereafter, he joined Texas Instruments and worked for more than 9 years as a senior ESD engineer responsible for regional ESD and EOS support in Europe. He then worked for 2.5 years as leader of the ESD team for Elmos Semiconductors S.E. and is currently working as senior ESD engineer for Robert Bosch GmbH in Germany. He is a member of the steering council and also a member of the managing board of the ESD FORUM e.V. He holds several patents and is the author or co-author of several papers, conference presentations, and tutorials in the fields of semiconductor power devices, ICs, semiconductor technologies, ESD and EOS. THRESHOLD™ MARCH/APRIL 2025 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 June Meeting Schedule 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ Continued on the next page
THRESHOLD™ MARCH/APRIL 2025 HOTEL INFORMATION Rate: $109/night; nights of 6/6 and 6/7 are $149/night Cut off May 9, 2025 Book your hotel room online! https://nuggetcasinoresort.book.pegsbe.com/promo?propertyCode=NCR&offerCode=GEOS25 Group code: GEOS25 Toll free number: 800.648.1177 NOTE: Guests will be charged the first night’s stay upon booking. There is a $4.95 merchant fee per room per stay for credit card payments. Cancelations are allowed without penalty up to 24 hours prior to arrival date. You are encouraged to book your room because our room block can run out before the booking cutoff. The resort fee of $35 waived and amenities included are: guestroom wireless internet, two bottles of water, fitness center and pool, complimentary shuttle plus self-parking. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/ June Meeting Schedule
THRESHOLD™ MARCH/APRIL 2025 GaN devices: Technology, reliability-limiting processes and ESD failures Speaker: Professor Mattero Meneghini, University of Padova GaN has emerged as an excellent material for application in many fields: optoelectronics, RF systems and power conversion. The most adopted GaN transistor structure is the high electron mobility transistor (HEMT), which is based on the use of an AlGaN/GaN heterostructure. Such devices have excellent properties for application in base stations (for RF devices) and in the power conversion field (e.g. for automotive, renewable energy conversion, consumer electronics, etc.). Starting from an overview on GaN technology and on the main device architectures, this talk will present an overview on the main reliability-limiting processes of GaN devices, and on the stability/robustness of these devices against electrostatic discharge (ESD) events. Matteo Meneghini received his PhD (University of Padova) working on the optimization of GaN-based LED and laser structures. He is now full professor at the Department of Information Engineering at the University of Padova. His main interest is the characterization, reliability and modeling of compound semiconductor devices (LEDs, laser diodes, HEMTs), and optoelectronic components, including solar cells. Within these activities, he has published more than 400 journal and conference proceedings papers. During his activity, he has cooperated and/or co-published with a number of semiconductor companies and research centers. He has been elected IEEE Fellow (Class of 2025). He – together with his colleagues - won several best paper awards at international conferences. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 GaN devices: Backside Interconnects for Future Advanced Nodes Speaker: Ruilong Xie, IBM As CMOS technologies scales beyond 2nm, the frontside of the wafer offers diminishing opportunities for area scaling due to the approaching physical limits of the gate pitch and the BEOL copper pitch. While various strategies are being explored to enhance gate pitch and BEOL Cu pitch scaling, such as 2D material channels and subtractive ruthenium interconnects, or enabling cell height scaling through flexible cell height and stacked FET transistors, a more promising approach lies in advancing interconnect technology on the wafer's backside. Utilizing the wafer backside opens numerous opportunities, including backside power and signal integration, the development of backside functional devices, and simplified integration for vertical or stacked transistors. However, it also introduces challenges such as handler wafer bonding, substrate thinning, passive device formation, diverse methods for backside interconnect formation, backside overlay errors, and constraints related to processing thermal budgets and thermal dissipation. This talk will explore these opportunities and challenges. Ruilong Xie (Senior Member, IEEE) received his Bachelor of Engineering degree in 2006 and Ph.D. degree in 2010 in Electrical and Computer Engineering from the National University of Singapore (NUS). During his Ph.D., he worked in the Silicon Nano Device Laboratory at NUS and was associated with the Institute of Microelectronics, Agency for Science, Technology and Research, Singapore. His doctoral research focused on high-mobility germanium channel MOSFETs with high-k gate dielectrics. In 2009, Ruilong joined Chartered Semiconductor Manufacturing in Singapore, where he contributed to the development of 45nm and 55nm CMOS technologies. He later moved to the GLOBALFOUNDRIES Research division in Albany, NY, working on advanced FinFET technologies (14nm, 10nm, and 7nm FinFET nodes) as part of the IBM Technology Development Alliances. Since 2018, Ruilong has been with IBM Research, focusing on advanced technology nodes, including nanosheet transistors, vertical transistors, and backside interconnect technologies. He holds more than 1,000 U.S. patents and has authored or co-authored over 30 conference and journal papers. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 Small wonders, Monumental impact: The World of Semiconductor Innovation Speaker: Myung-Hee Na, Intel Truly remarkable technological innovations such as Large Language Models (LLM), AI, robotics, and more have forever changed our daily lives over the past decades. Advanced CMOS semiconductor technologies have been recognized as key enablers of these advancements. Innovations in transistor architecture, from planar to FinFET, and continued lithographic scaling with EUV have pushed CMOS technologies below the 10nm node. Furthermore, the CMOS scaling roadmap continues with groundbreaking advancements such as PowerVia and RibbonFET, setting new benchmarks in performance and efficiency. However, the current AI trend demands unprecedented levels of performance and energy efficiency in semiconductor technologies, which we have never seen before. Continuing advancements in CMOS technologies toward extreme scaling are a starting point to meet this challenge. To deliver the ultimate value proposition of systems, co-innovation between CMOS technology and advanced packaging is also very important. By aligning silicon and packaging innovations with workload-specific system requirements, it may be possible that the industry can meet the insatiable demand for AI capabilities. This talk discusses the technology trends and key technological innovations in a holistic approach toward a path to tackle this grand challenge. Myung-Hee Na is currently the Vice President and Technology Systems General Manager in Intel, USA. Over 20 years, she has been known as the semiconductor technologist and held various executive positions in global semiconductor companies including US, Belgium and Korea. She has been very diverse and deep semiconductor experiences from device to designs including logic and memory technologies over 20 years. Prior to joining Intel in April 2024, over the past three years she was Vice President of the Revolutionary Technology Center in SK Hynix, Korea. In this role she was responsible for multi-decade semiconductor research roadmaps and strategies for memory centric and emerging computing domains such as emerging memory, and beyond memory. From 2019-2023, Myung-Hee also worked at imec in Belgium where she was Vice President, Technology Solutions and Enablement. In this role she was responsible for overall 10-year research strategies for CMOS pathfinding and emerging computing domains such as edge computing. After completing her Ph.D. in Physics, Dr. Na started her career at IBM in 2001, where she held various technical, managerial and executive roles until early 2019. During that time, she was promoted to Distinguished Engineer and Technical Executive. At IBM Research, she successfully led Research and Development for multiple generations of semiconductor technologies, including high-K metal gate, FinFET, and Nanosheet development. Moreover, she has co-authored numerous research papers and U.S. and international patents. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 Newly Released Documents ANSI/ESDA/JEDEC JS-001-2024 - ESD Association Standard Test Method for the Protection of Electrostatic Discharge Susceptible Items – Ionization This document is revision of ANSI/ESDA/JEDEC JS001-2023 Order now at: https://www.esda.org/store/standards/ ANSI/ESD STM3.1-2024 - ESD Association Standard Test Method for the Protection of Electrostatic Discharge Susceptible Items – Ionization This document is reaffirmation of ANSI/ESD STM3.1-2015 For the Protection of Electrostatic Discharge Susceptible Items Ionization Order now at: https://www.esda.org/store/standards/product/264/an siesd-stm3-1-2024/ ANSI/ESD SP5.1.4-2024 - ESD Association Standard Practice for Electrostatic Discharge Sensitivity Testing – Human Body Model (HBM) Testing – Device Level – A Method for Random Sampling of Power Pins For Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) Testing Device Level A Method for Random Sampling of Power Pins This document is new. Order now at: https://www.esda.org/store/standards/product/429/an siesd-sp5-1-4-2024/ 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 Fab Certification White Paper Announcement Do you know if your semiconductor wafer fabrication house or reticle repair/fabrication facility has the proper electrostatic discharge (ESD) / electrostatic attraction (ESA) controls in place? Do you know what ESD/ESA controls are currently being used in the industry? If not, you should check out the latest white paper from the EOS/ESD Association titled “Electrostatic Discharge (ESD)/Electrostatic Attraction (ESA) Considerations in Semiconductor Wafer Fab and Associated Facilities”. It can be downloaded for free at https://www.esda.org/certification/. Several semiconductor integrated device manufacturing (IDM) representatives have stated that their customers have requested that the IDMs provide proof and/or certification that their established ESD/ESA control program is sufficient for their respective semiconductor manufacturing processes. While semiconductor fabs have some ESD/ESA controls, most do not have a certified ANSI/ESD S20.20 ESD control program. ESD/ESA control methodologies in a fab are covered in different areas of responsibility (quality, manufacturing, process control, tool maintenance, etc.), so it can be challenging to pull together a consensus document that would prove that the facility has proper controls in place for all ESD/ESA risks. This document reviews ESD/ESA challenges, considerations, and best practices in semiconductor manufacturing. It compares and contrasts semiconductor wafer and mask house manufacturing ESD/ESA best practices to those for electronics manufacturing and assembly, which ANSI/ESD S20.20 is designed for. Other areas closely linked to a semiconductor fab, like die-to-die and wafer-to-wafer bonding, reticles, and backside power delivery networks, are also discussed. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 New Projects in Standards ANSI/ESD SP14.5-2021 - ESD Association Standard Practice for Electrostatic Discharge Sensitivity Testing – Near Field Immunity Scanning - Component/Module/PCB Level This document is starting a five-year review. ANSI/ESD STM11.11-2022 - ESD Association Standard Test Method for Protection of Electrostatic Discharge Susceptible Items – Surface Resistance Measurement of Planar Materials This document is starting a five-year review. ANSI/ESD STM11.12-2021 - ESD Association Standard Test Method for Protection of Electrostatic Discharge Susceptible Items – Volume Resistance Measurement of Planar Materials This document is starting a five-year review. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
THRESHOLD™ MARCH/APRIL 2025 Press Release An Overview of ANSI/ESD S20.20 - The Cornerstone of Semiconductor control programs The ANSI/ESD S20.20 standard has become the cornerstone for developing effective ESD control programs. This standard is essential for safeguarding sensitive electronic components and minimizing failure rates. A landmark development in ESD control came in 1995 when the U.S. Department of Defense (DoD) asked the ESDA to lead the creation of an updated ESD control standard for both military and commercial use. The result was the introduction of ANSI/ESD S20.20 in 1999, which quickly became the industry standard, adopted by the DoD and various military branches. By adopting standards, businesses can mitigate the risks of ESD, ensuring the protection of their equipment, maintaining customer confidence, and avoiding costly failures. The continued evolution of ESD control standards and certification programs underscores the importance of addressing this invisible yet potentially destructive force in modern industry. Adhering to the requirements outlined in ANSI/ESD S20.20 is a sound business decision that mitigates the risk of poor customer experiences and potential revenue loss. The guidelines provided by EOS/ESD Association, Inc. are clear, practical, and essential for ensuring optimal organizational performance. Given that a single component failure can result in the loss of a customer, the time and financial investment required to implement these requirements is a worthwhile and strategic commitment. Lisa Pimpinella, Sr. Executive Director indicates, "Electrostatic discharge remains an invisible yet critical challenge in modern industries, and ANSI/ESD S20.20 provides the foundation for effective control. As the industry standard, it reflects the EOS/ESD Association’s commitment to safeguarding technology, ensuring reliability, and driving best practices that protect businesses and customers alike." The continued evolution of ESD control standards and certification programs underscores the importance of addressing this invisible yet potentially destructive force in modern industry. To view the full article detailing this information, please refer to www.esda.org, social media presences on Facebook and LinkedIn, or contact Lisa Pimpinella, Executive Director via e-mail at lpimpinella@esda.org, or call (315) 339-6937. 218 W. Court St., Rome, NY 13440 + 315-339-6937 Email: info.eosesda@esda.org Web Site: https://www.esda.org/
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