WG 18.0 – Electronic Design Automation (EDA)

Summary of meeting activities:

The committee reviewed a general working group and document status update. The group finished reviewing the new latch-up EDA technical report and will submit for TAS review. The committee is preparing to start an update to ESD TR18.0-01-14.

Summary of meeting activities:

The committee continued working on the new latch-up EDA technical report.

Agenda:

• WG18 activities update (LU and ESD EDA TRs status)
• WG18 sub teams reports
• Q&A

Summary of meeting activities: 

The group reviewed general working group updates, as well as sub-teams’ finalization. The new latch-up EDA technical report is near the finalization for publication. Also, updates from sub-teams working on different document chapters for an update to the ESD ESA technical report were given.

The committee discussed possible promotional opportunities for the recently published technical report on latch-up EDA - ESD TR18.0-02-20. Additional updates were given on the status of revisions to ESD TR18.0-01.

ESDA WG18 EDA - ESD and Latch-up TR Meeting - September 1, 2022

Notes and Action Items: 

• General:
  • The latest draft of master document is “ESD EDA TR - Draft – September 1, 2022.docx, ” the latest draft of figures document is “ESD EDA TR - Figures – September 1, 2022.pptx. “
  • TR Word document has the latest edited versions of all submitted chapters, including the latest updates to SPICE chapter. Please review. The plan is to complete the remaining two chapters (Package and TCAD) in September/October and start aligning chapters content between each other and with the flow/introductory chapters.
  • PPT Figure document has been synchronized with the Word document and contain all Figures. Please use PPT file for any further Figure editing.
  • No in-person general WG meeting is planned at the ESD Symposium since most working group members will not be traveling. However, informal meetings focused on individual chapters (TCAD chapter, package chapter, other?) will be arranged in Reno.
• Package Checks Chapter:
  • Did not discuss at the meeting.
  • Plan to discuss chapter in detail at the next meeting. Sub team meeting is planned next week.
  • Action Items:
    • [Package Checks Sub-team]:  Complete flow figure alignment (see notes from previous meetings).
    • [Package Checks Sub-team]:  Add flow figure write up to the chapter.

• SPICE Simulation Chapter:
  • Expanded flow Figure caption. Edited it to include reference in chapter text. – see updated Word draft for more details.
  • Action Items:
    • Review chapter and flow figure and provide feedback for any modifications and/or additions.
• System Checks Chapter:
  • Solicited additional feedback on the chapter from WG26 (System Level Modeling). Will follow up next week.  
  • Action Items:
    • Follow up with WG26 on additional chapter feedback.  
    • Review chapter and flow figure and provide feedback to for any modifications and/or additions.
• Schematic-Based Static Topological Checks Chapter
  • Did not discuss at the meeting
  • Action Item:
    • Review chapter flow figure and provide feedback to for any modifications and/or additions.
• Layout-Based Checks Chapter (CD/P2P/LDL):
  • Did not discuss at the meeting.
  • Action Item:
    • Review chapter flow figure and provide feedback to for any modifications and/or additions.
• TCAD Simulation Chapter:
  • Did not discuss at the meeting.
  • Action Items:
    • [TCAD Sub-team]:  Finalize chapter to include it in the main document. Add flow figure write up to the chapter.
    • Review all chapters flow figures to add technology enablement information.
• General Flow Chapter:
  • Did not discuss at the meeting.
  • Action Items:

• [Flow Sub-Team]: Update chapter text: add description and reference the new flow figure (slide 4).

The next WG teleconference is planned for Thursday, September 29^th. Proposed agenda for this meeting is as following:

1. Package checks chapter update
2. Feedback on newly added chapters (chapters 7 and 8)
3. Follow-up on ESD Symposium meetings.
4. General document flow.

• CODE OF CONDUCT

The Standards business unit has issued a new Code of Conduct policy for Standards Meetings, this policy is in accordance with ANSI process. It was shared during face-to-face Standards meetings held in March. The same policy applies also to our Working Group, and All Members are asked to follow it. I read the Etiquette and Policies slides of ESDA Code of Conduct during the meeting, you can find a copy of the policies in www.esda.org > Committees > Standards Working Groups.

• ESD EDA TR:

These 2 files are linkable from “useful links” section:

• • • The latest official draft of master document is “ESD EDA TR - Draft - March 23, 2024.docx”
    • The latest official draft of figures document is “ESD EDA TR - Figures -March 15, 2024.pptx “

• • Chapters wip (All):
    • Chapter 3 (flow)
      • Provided an edited version of FLOW chapter (draft document was sent to FLOW sub-team, with embedded also latest modifications):

                             -  All FLOW sub-team members please provide feedback by March 28^th if possible.

                                                          - All FLOW sub-team members need help for review of 3.3.1 and 3.3.2 

• Will finalize edits after FLOW sub-team feedback and will embed final version of FLOW chapter in current TR by April 11^th

• • • Chapter 5 (layout-based DRC/CD/P2P/LDL checks)
      • Will open points of last chapter review

• • • Chapter 6 (package checks)
      • Provided an edited version of this chapter, embedded in latest TR draft version “ESD EDA TR - Draft - March 23, 2024.docx”: All – please help in review
    • Chapter 7 (system level)
      • Will edit this chapter by next weeks
    • Chapter 8 (SPICE)
      • Full review to be performed
    • Chapter 9 (TCAD)
      • Full review to be performed

• All are encouraged to perform the chapters reviews (also editing and alignment in terminology are very important points needing for review)

• UPCOMING EVENTS:

• EOS/ESD Symposium 2024 (September 15-19) – EDA will be focus topic for this year edition of the Symposium, with our WG focus presentation of Technical Report. It’s very important that our TR will be completed and submitted to TAS by end of May/June. Concerning papers, the review and acceptance process of abstracts has been finalized: there will be quite a few EDA papers.
• IEW US 2024 (April 16-18, co-located with IRPS 2024) – there are a couple of posters related to EDA
• IEW ASIA 2024 (July 15-18, co-located with IPFA 2024) – Misha will give an ESD EDA tutorial
• IEW EUROPE 2025 will be in Croatia

• WG 18 – other upcoming activities:

• 3D INTEGRATION – in the next future we will probably have the chance to work on helping to build a standard practice for 3D integration by taking relevant information from our ESD EDA technical report. The aim is to build an EDA flow on 3D integration as reference for EDA vendors and customers.

• Bi-weekly virtual meetings
• Finalization of the new version of ESD TR18.0-01, submission to TAS is planned in early October 2024
• ESD EDA interactive presentation was held at EOS/ESD Symposium 2024
• New ESD TR18.0-01 version covers all verification types
  • Introduction, ESD concepts, verification flow FINALIZED
  • Schematic-based static topological FINALIZED
  • Layout-based FINALIZED
  • Package FINALIZED
  • System FINALIZED
  • Spice FINALIZED
  • TCAD FINALIZED
• EDA INTERACTIVE PRESENTATION/WORKSHOP AT 2024 EOS/ESD SYMPOSIUM
  • Presentation was given by Michael Khazhinsky and was focused on the new completed revision of WG18 TR on ESD Electronic Design Automation and followed its structure.
  • Presented slides for each chapter were followed by the interaction with the audience (Q&A, comments).
  • Eight WG18 members (Dolphin Abessolo Bidzo, Subhadeep Ghosh, Matthew Hogan, Peter Koeppen, Kuo-Hsuan Meng, Steven Poon, Andrei Shibkov, Vlad Vashchenko) who contributed to the TR were present and helped to facilitate audience questions.
• Contribution in advanced packaging item
  • Participation in last meetings of ESDA Advanced Packaging Task Team
  • Sharing of TR content on Advanced Packaging EDA item
  • Planned possible WG 18 contribution on EDA aspects in future heterogeneous/3D integration documents
• InCompliance article on the new version of ESD TR18.0-01
• TR18.0-01 addendum – a separate document summarizing ESD EDA checks and referencing the TR (former TR appendices)

Summary of meeting activities:

The committee reviewed a general working group and document status update. The group continued working on the new latch-up EDA technical report.

Summary of meeting activities:

The group reviewed general working group updates and continued working on the new latch-up EDA technical report.

Summary of meeting activities:

An overview on the history and current activities of committee were presented. The working group continued reviewing the working draft of a new latch-up EDA TR.

Summary of meeting activities:

An overview on the history and current activities of committee were presented. The working group continued reviewing the working draft of a new latch-up EDA TR and an ESD EDA reference flow.

Summary of meeting activities:

After a brief history of the working group was presented, the committee continued working on a new latch-up EDA technical report.

Summary of meeting activities:

The current status of the latch-up EDA technical report was reviewed and new additions were discussed.

Summary of meeting activities:

The current status of the latch-up EDA technical report was reviewed; a draft is underway and is expected for review in the near future. The committee also reviewed the status of ESD TR18.0-01; an update to the document to include the latest published ESD EDA case studies is expected for the second half of 2017.

Summary of meeting activities:

The working group reviewed future directions for developing the ESD EDA technical report. Given the size of the existing report, any significant expansion was not advised. Updates to the ESDA report will be made on a 3-year cycle to include the latest published ESD EDA case studies starting in 2017. The group discussed possible next steps for ESDA / Si2 cooperation and further meetings will be held to develop the scope of cooperation. The committee also reviewed the latch-up EDA technical report outline and the document’s current context. The goal is to have a rough draft of the report to be completed by the beginning of 2017.

Summary of meeting activities:

A review of WG18 activities and plans for documents on ESD EDA and latch-up EDA were reviewed with the attendees. The 2016 EOS/ESD Symposium presentation and technical paper on latch-up EDA were discussed. The committee also reviewed the current status of the new technical report being written on latch-up EDA. The committee will continue working on the technical report at the September meeting.

Summary of meeting activities:

The committee continued discussions on an EOS/ESD Symposium paper abstract for latch-up EDA. A high level review of WG18 (ESD EDA and Latch-up EDA), adhoc WG (ESD SPICE/Compact Modeling),WG22 (ESD Parameters), and adhoc WG (ESD IP) activities and plans were presented for new meeting participants.