WG 5.4 – Transient Latch-up (TLU) Device Testing

Summary of meeting activities:

The committee completed adjudication of TAS comments on ESD TR5.5-04. The document is expected to be published before the June virtual meeting series. A presentation was given on a proposal for a new technical report on transient response. A first draft is expected to be distributed to a writing team before the June meeting series. There was also a discussion on future work for the group; further discussion will be held at the September face-to-face meeting.

Summary of meeting activities:

The working group adjudicated technical comments from industry review on the new standard practice document being developed. The WG will have a short meeting at the April 2018 face-to-face meeting to discuss parking lot items, publications, and a TLU tutorial for the EOS/ESD Association, Inc. device stress testing curriculum.

Summary of meeting activities:

The working group adjudicated technical standards committee recirculation vote comments on ESD WIP5.4.1. The document will be distributed for industry review in October. The group also decided to write a technical paper the 2018 EOS/ESD Symposium to discuss the test method in ESD WIP5.4.1. Once the new standard practice is published there are no plans to redesignate the document as a standard test method so the working group may go dormant until new work is identified.

Summary of meeting activities:

The committee continued discussions on new topics for the working group to explore after the current standard practice being developed is published.

Summary of meeting activities:

The committee reviewed the current status of ESD WIP5.4.1 and continued a discussion on possible new projects for the working group after publication of the document. One suggestion is to find suitable devices for applying the TLU characterization method defined in ESD WIP5.4.1.

Summary of meeting activities:

The committee adjudicated technical comments from the Technical and Administrative Support committee. A discussion was held on future topics for the working group to consider including finding suitable devices for applying the transient latch-up characterization method defined in TR5.4-03 and publish the results at IEW or at a future EOS/ESD Symposium.

Summary of meeting activities:

The current status of ESD WIP5.4.1, a standard practice for transient latch-up testing, was reviewed and the next steps along with a timeline were reviewed.

Summary of meeting activities:

The committee finalized technical additions to new document ESD WIP5.4.1 and the document will be submitted for TAS review before the July virtual meeting. A presentation was give on a method to inject transients into PCB. The WG will consider the topic for future work.

Summary of meeting activities:

The committee finalized technical additions to new document ESD WIP5.4.1 and will complete a final review by WG members. The document is expected to be submitted for TAS review before the April meeting series. The committee discussed the feasibility of single lab and round robin testing of the TLU set-up described in the document and will begin gathering the devices necessary to complete the testing.

During the meeting, discussed the 5-year review requirement of the SP5.4.1 “Transient Latch-up Testing Device Level” document and determined that it could be reaffirmed with only minor editorial changes, no technical changes at this time.  Document changes will be completed and forwarded to headquarters for review. 

The relevance of TLU testing was discussed, with a questioning being asked “how many are using this method”?  This led into a discussion on the results of the Industry Council of ESD Target Levels “Latch-up survey” which yielded a significant amount of “TLU issues”, not captured by other “static test methods”.

Based on these reviews, the WG will explore whether SP5.4.1 or any other TLU methodology was used for debugging and/or characterization.

      Companies using TLU characterization are be invited to the next WG meeting.

In previous meetings, the WG discussed what the next steps should be for the TLU WG.

Also discussed were the results of the Industry Council of ESD Target Levels “Latch-up survey”, which yielded a significant amount of “TLU issues” not captured by other “static test methods”. Although there may be some communication with JEDEC78 on the inclusion of TLU in a JEDEC document, the WG decided to go dormant as, currently, no technical work on the TLU characterization method or on the SP is required. WG will reconvene if there is a strong industry request.