Ankit Srivastava received a B.S. Technology degree in Electrical Engineering from the Indian Institute of Technology (IIT) in 2003 and a M.S. degree from University of Illinois Urbana-Champaign (UIUC), in 2008. His research work at UIUC involved using design techniques to extend bandwidth of ESD protected high speed serial links. From 2003 to 2006, he was working at ST Microelectronics, Noida, India, as a design engineer in the high speed IO design group. During the summer of 2007, Ankit was at IBM Microelectronics, Essex Junction, VT, for a student internship where he worked on ESD protection of high speed current mode logic (CML) drivers. Since Aug 2008, Ankit is with Qualcomm Inc., San Diego, CA, as a mixed signal design engineer where he designed and leads the effort for IEC level ESD protection for Audio chips. Ankit has 4 publications in international conferences and 25 patents issued or pending in the field of ESD protection, high speed IO design, audio power amplifiers and general mixed signal design.
Ankit likes to spend quality time with his family. Playing with his toddler son is the most relaxing activity for him. An avid nature lover Ankit loves biking and hiking. He also enjoys travelling to different places. While at home he likes cooking different cuisines.
Ankit was a member of 2014 ESD symposium technical program subcommittee for "System Level Testing and Analysis" and "System level case studies".
"Being an ESDA volunteer has helped me learn, evolve, and grow in this field. It not only helped me in meeting industry experts but also expand my knowledge base. The experience that I gained is invaluable."