Certified Professionals

Christopher Long is a senior engineer in the IBM Research Division, with over 26 years experience in semiconductor manufacturing. He currently has been involved in development of magneto-resistive random access memory (MRAM) products. Previous to this assignment, he had responsibility in the area of contamination and ESD control program strategy at IBM 200 & 300mm semiconductor manufacturing facilities. Mr. Long has published numerous papers on semiconductor manufacturing defect reduction and yield modeling, and has served as U.S. chair of the International Technology Roadmap for Semiconductors (ITRS) Yield Enhancement technology working group, responsible for development of the Yield Enhancement chapters of the 2001 and 2003 ITRS. Mr. Long received a B.S. in Physics from Beloit College, Beloit, WI (1980), and an M.S. in Engineering from the Thayer School of Engineering, Dartmouth College (1990), Hanover, NH. cwlong@us.ibm.com

Credential ID: https://esdcertification.esda.org/en/c/1670f85675bd4b42b51c0c99cfbddcd4

Christopher Smith works in ESD control and general quality auditing at Kimball Electronics Jasper. He was born in Indiana and grew up with a love of technology that led him to a career in manufacturing. He spends most of his spare time building and modifying his own PC at home, as well as finding new ways to entertain his cat. He’d like to travel to Ireland someday, time permitting. He has a bachelor’s from Ball State University in Telecommunications with an emphasis on Screenwriting and Video Editing, and has used this knowledge to assist with many corporate videography projects in addition to in-house training programs. He hopes to utilize those skills to create new educational ESD tools to help control static in the workplace. He has successfully co-led KEJ’s transition to ANSI S20.20 certification 5 years in a row.

Credential ID: https://esdcertification.esda.org/en/c/c7d29d3e482d4631adedef2a6ed14e4b

Chuck is an ESD Engineer at Micron Technology Inc. and ESD Coordinator for Micron’s Boise Idaho Facility. He is a founding member of Micron’s Corporate ESD steering team which maintains Micron’s ESD Specifications. Chuck is the aco-chair for SEMI ESD. He is also a member of several ESDA working groups.

Interests outside of work include, hunting, fishing, hiking, Scottish Highland Games, and veteran outreach activities.

Credential ID: https://esdcertification.esda.org/en/c/90b4213cb17642b9bd33452a384f1a3e

Credential ID: 2d23083a54bb4817883f8a7ee3efabe1

Chung‑Ti Hsu received the B.S. and M.S. degrees in electronics engineering from National Chiao Tung University (NCTU), Hsinchu, Taiwan, in 2001 and 2003, respectively, and the Ph.D. degree in electrical and computer engineering from Northeastern University, Boston, MA, USA, in 2014.

From 2003 to 2008, he was with Winbond Electronics Corporation, Hsinchu, Taiwan, working on electrostatic discharge (ESD) and latch‑up protection design and failure analysis for logic, analog, RF, LCD driver, DRAM, and Flash memory ICs. In 2008, he joined Nuvoton Technology Corporation as a Technology Assistant Manager, leading the development of latch‑up‑free ESD protection designs in Bipolar/CMOS/DMOS (BCD) technologies for smart power applications.

Since 2014, he has been with Qualcomm Technologies, Inc., where he is currently a Senior Staff Engineer. His work focuses on ESD and latch‑up protection architecture, design sign‑off, and silicon validation for PMIC, fingerprint, envelope‑tracking, and mixed‑signal products. He has designed and co‑designed ESD protection solutions for more than 100 production ICs.

Outside of his professional work, he enjoys reading, basketball, running, and playing Go—long regarded as the last board game to resist computers until March 15, 2016. Since April 2023, he has focused on distance running, achieving a personal best of 1:44:14 in the half marathon, and is currently training for his first full marathon. 

Credential ID: 3e1b7ba817bc45ffbb76638f16428dba

Credential ID: https://esdcertification.esda.org/c/4057a75fad6e458aa64a26380607bcbb
 

Colin Banks is a Quality Engineer at Kyocera International Inc. for their Assembly Technology Division. He specializes in the wirebonding process, but is also involved in various flip chip products. His duties include failure / root cause analysis and corrective actions as well as process improvement using lean / six sigma methodology.

Academically, Colin has earned his BS in Mechanical Engineering from San Diego State University and a Lean Six Sigma Certificate from San Diego City College.

Outside of work Colin enjoys building and racing cars, as well as analog photography.