Certified Professionals

John is a Senior Engineer in the Software Development and System Compliance department of IBM in Poughkeepsie, NY. He has been the ESD Site Coordinator for the Poughkeepsie and Kingston IBM sites since 1989. John is the past chairman of the IBM Interdivisional Technical Liaison Committee for ESD Protection and is currently part of the committee to develop and implement the ESD Corporate program for IBM.

John joined the company in 1979 after graduating from the State University of Buffalo, where he received a Bachelor or Science Degree in Electrical Engineering. John continued his education while working for IBM and received his Masters of Science Degree in Electrical and Computer Engineering from Syracuse University in 1986.

John has been a member of the ESD Association since 1990 and has been active in the Standards committees. Currently he is a member of the Technical and Advisory Committee and a member of the Standards Committee. He was appointed to the position of secretary of the ESD Association, elected to the Board of Directors, elected to President of the ESD Association, and was the General Chair of the EOS/ESD Symposium in 2001. 

John was presented with the Joel Weidendorf award for Standards in 2005 and the Outstanding Contribution Award in 2006. 

John has presented several papers both internal to IBM and at external conferences. He participates as an instructor for the Program Management series and has presented tutorials in North America and Asia.

John is the business unit manager of the facility certification program. He has trained assessors from all of our accredited certification bodies.

John is the Chief Delegate to the IEC for Technical Committee 101, Electrostatics. This committee is responsible for developing international standards. As part of this committee, the revision to IEC 61340-5-1 will be technically equivalent to ANSI/ESD S20.20-2007.

Joe Kane is Senior Principal Engineer for BAE Systems in Endicott, New York, working in process engineering and supplier quality. He holds a BS in Mechanical and Aerospace Engineering from Cornell University, and completed GE’s Manufacturing Management Program. He contributes to several IPC committees for design and fabrication of printed boards and electronic assemblies.